S. Sardo

Small Pitch, High Aspect Ratio Via-Last TSV Module

G. Beyer, E. Beyne, S. Van Huylenbroeck, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Line edge roughness (LER) reduction strategy for SOI waveguides fabrication

Stefano Sardo, Massimo Gentili, M. C. Ubaldi, 2008 .

"Hole-in-One TSV", a New Via Last Concept for High Density 3D-SOC Interconnects

Eric Beyne, Anne Jourdain, Andy Miller, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Pharmacological inhibition of ictal and interictal epileptiform discharges

S. Sardo, Barbara Piras, 2023, Working Paper of Public Health.