L. Bogaerts

Small Pitch, High Aspect Ratio Via-Last TSV Module

G. Beyer, E. Beyne, S. Van Huylenbroeck, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias

E. Beyne, B. Swinnen, L. Bogaerts, 2006, 2006 International Electron Devices Meeting.

Deepdrawing of composite sheet materials

Mieke Lossie, L. Bogaerts, D. Vandepitte, 2001 .

Hybrid 14nm FinFET - Silicon Photonics Technology for Low-Power Tb/s/mm2 Optical I/O

K. Rebibis, S. Van Huylenbroeck, P. Verheyen, 2018, 2018 IEEE Symposium on VLSI Technology.

Hybrid 14 nm FinFET-Silicon Photonics Technology for Low-Power Tb / s / mm 2 Optical I /

K. Rebibis, P. Verheyen, D. Velenis, 2018 .

High-Speed TSV Integration in an Active Silicon Photonics Interposer Platform

S. Van Huylenbroeck, P. Verheyen, D. Velenis, 2018, 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).

Packaging of 11 MPixel CMOS-Integrated SiGe Micro-Mirror Arrays

P. De Moor, A. Witvrouw, L. Haspeslagh, 2009, 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems.

TSV-assisted Hybrid FinFET CMOS - Silicon Photonics Technology for High Density Optical I/O

K. Rebibis, D. Guermandi, S. Van Huylenbroeck, 2019, European Conference on Optical Communication.

Integration of etched facet, electrically pumped, C-band Fabry-Pérot lasers on a silicon photonic integrated circuit by transfer printing.

Sarah Uvin, Joris Van Campenhout, Dries Van Thourhout, 2018, Optics express.

Key elements for sub-50μm pitch micro bump processes

E. Beyne, J. De Vos, C. Gerets, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

High-bandwidth density optically interconnected terabit/s boards

Francesco Testa, Xin Yin, Johan Bauwelinck, 2018, OPTO.