F. Kuper

发表

Characterization and modeling of second breakdown in NMOST's for the extraction of ESD-related process and design parameters

A. Amerasekera, L. V. Roozendaal, J. Bruines, 1991 .

Suppression of soft failures in a submicron CMOS process

J. Bruines, F. Kuper, J. Luchies, 1993 .

Suppression and origin of soft ESD failures in a submicron CMOS process

J. Bruines, F. Kuper, J. Luchies, 1994 .

MOSFET Degradation Under RF Stress

F. Kuper, J. Schmitz, G. Sasse, 2008, IEEE Transactions on Electron Devices.

Impact of nano particles on semiconductor manufacturing

F. Kuper, D. M. Knotter, F. Wali, 2008, 2008 IEEE International Multitopic Conference.

Charging induced damage on complex-antenna test structures

Cora Salm, J. Ackaert, Fred G. Kuper, 2001 .

Zapping thin film transistors

Ton J. Mouthaan, Fred G. Kuper, N. Tosic Golo, 2002, Microelectron. Reliab..

Time-dependent Degradation Effects in Top-gate Amorphous Silicon Hydrogenated Thin-film Transistors

F. Kuper, S. V. D. Wal, A. Mouthaan, 2000 .

Fast Thermal Cycling-Enhanced Electromigration in

F. Kuper, H. Nguyen, C. Salm, 2004 .

Temperature effect on antenna protection strategy for plasma-process induced charging damage

F. Kuper, A. Scarpa, C. Salm, 2002, 7th International Symposium on Plasma- and Process-Induced Damage.

Temperature effect on protection diode for plasma-process induced charging damage

F. Kuper, A. Scarpa, C. Salm, 2002 .

Assessing the degradation mechanisms and current limitation design rules of SiCr-based thin-film resistors in integrated circuits

A. Grzegorczyk, F. Kuper, D. Donnet, 2010, 2010 IEEE International Reliability Physics Symposium.

Differential reflectometer for studies of adsorption on stepped crystal surfaces

F. Kuper, L. Wolterbeek, M. Hottenhuis, 1982 .

Electrothermomigration-induced failure in power IC metallization

F. Kuper, H. Nguyen, C. Salm, 2003 .

State-of-the-Art on Thermo-Mechanical Modelling of IC Back-End Processes

W. D. van Driel, R. van der Weerd, Fred G. Kuper, 2001 .

Vertical die crack stresses of Flip Chip induced in major package assembly processes

M. S. Kiasat, Leo J. Ernst, Daoguo Yang, 2000 .

Plasma-charging damage of floating MIM capacitors

F. Kuper, J. Ackaert, M. Tack, 2004, IEEE Transactions on Electron Devices.

Yield and reliability effects of interlevel dielectric plasma enhanced deposition induced charging damage

F. Kuper, A. Scarpa, L. van Marwijk, 2001, 2001 6th International Symposium on Plasma- and Process-Induced Damage (IEEE Cat. No.01TH8538).

Fast thermal cycling-enhanced electromigration in power metallization

J. Bisschop, C. Salm, H.V. Nguyen, 2004, IEEE Transactions on Device and Materials Reliability.

Deposition and detection of particles during integrated circuit manufacturing

F. Kuper, J. Kelly, D. M. Knotter, 2006 .

Reliability implications in advanced embedded two-transistor-Fowler–Nordheim-NOR flash memory devices

Jelke Dijkstra, Fred G. Kuper, Guoqiao Tao, 2002 .

Fast-bit-limited lifetime modeling of advanced floating gate non-volatile memories

Jelke Dijkstra, A. Scarpa, Guoqiao Tao, 2000, 2000 IEEE International Integrated Reliability Workshop Final Report (Cat. No.00TH8515).

Impact of screening of latent defects at electrical test on the yield-reliability relation and application to burn-in elimination

F.G. Kuper, J.A. Van der Pol, E.R. Ooms, 1998, 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173).

Effect of thermal gradients on the electromigration life-time in power electronics

J. Bisschop, C. Salm, F.G. Kuper, 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.

Virtual thermo-mechanical prototyping of electronic packaging using Philips optimization strategy

Guoqi Zhang, F. Kuper, Leo J. Ernst, 2000 .

Relation between yield and reliability of integrated circuits: experimental results and application to continuous early failure rate reduction programs

F. Kuper, J. van der Pol, E. Ooms, 1996, Proceedings of International Reliability Physics Symposium.

Modelling of the reservoir effect on electromigration lifetime

Cora Salm, Ton J. Mouthaan, Fred G. Kuper, 2001, Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548).

Actual Interconnect Issues and Solutions in ULSI Circuits

A. J. Mouthaan, Cora Salm, J. Holleman, 1999 .