J. Hammond

发表

INTEGRATED MEMS SWITCH TECHNOLOGY ON SOI-CMOS

Júlio Costa, T. Ivanov, J. Hammond, 2008 .

Polysilicon packaging and a new anchoring technology for thick SOI MEMS /sub y/namic response model and application to over-damped inertial sensors

J. Hammond, F. de Crécy, H. Grange, 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..

3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer

Lau Boon Long, C. T. Chong, Sharon Lim Pei Siang, 2023, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).

Silicon RFCMOS SOI technology with above-IC MEMS integration for front end wireless applications

J. Costa, M. Carroll, D. Kerr, 2008, 2008 IEEE Bipolar/BiCMOS Circuits and Technology Meeting.