N. Islam

发表

Prognostics and health management of electronics

P. Lall, M. Hande, C. Bhat, 2006, 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface.

Prognostication and health monitoring of leaded and lead free electronic and MEMS packages in harsh environments

P. Lall, J. Suhling, N. Islam, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Leading indicators-of-failure for prognosis of electronic and MEMS packaging

P. Lall, J. Suhling, N. Islam, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Feature extraction and damage-precursors for prognostication of lead-free electronics

J. Lee, P. Lall, M. Hande, 2006, ECTC 2006.

Electromigration for advanced Cu interconnect and the challenges with reduced pitch bumps

N. Islam, Gwang Kim, Kyung-Moon Kim, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Damage mechanics of electronics on metal-backed substrates in harsh environments

P. Lall, T. Shete, P. Lall, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Feature extraction and damage-precursors for prognostication of lead-free electronics

Jay Lee, Pradeep Lall, Madhura Hande, 2006, 56th Electronic Components and Technology Conference 2006.

Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments

P. Lall, J.C. Suhling, P. Choudhary, 2009, IEEE Transactions on Components and Packaging Technologies.

Methodologies for Prognostication and Health Monitoring of Leaded and Lead Free Electronics and MEMS Packages in Harsh Environments

Nokibul Islam, Pradeep Lall, Jeffrey C. Suhling, 2005 .

Study of FCMBGA with low CTE core substrate

Nokibul Islam, Miguel Jimarez, Robert Darveaux, 2009, 2009 59th Electronic Components and Technology Conference.

Reliability of small BGAs in the automotive environment

R. Wayne Johnson, Nokibul Islam, Jeffrey C. Suhling, 2002 .

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Pradeep Lall, Nokibul Islam, Jeffrey C. Suhling, 2007 .

Model for BGA and CSP reliability in automotive underhood applications

R. Darveaux, J. Suhling, N. Islam, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Optimization of Compression Bonding processing temperature for fine pitch Cu-column flip chip devices

Nokibul Islam, Eric Ouyang, Joonyoung Choi, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for Low Cost and High Performance Flip Chip Package

Nokibul Islam, Vinayak Pandey, KyungOe Kim, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

TIM selection methodology for high power flip chip packages

JinYoung Khim, Nokibul Islam, YunHyeon Ka, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.