I. Chen

Nanomechanical Switch Designs to Overcome the Surface Adhesion Energy Limit

T. Liu, E. Yablonovitch, I. Chen, 2015, IEEE Electron Device Letters.

Statistical modeling of silicon dioxide reliability

Chenming Hu, I-Ru Chen, Jack C. Lee, 1988 .

Stable ruthenium-contact relay technology for low-power logic

T. Liu, R. Nathanael, V. Pott, 2013, 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).

Micro-relay reliability improvement by inkjet-printed microshell encapsulation

V. Subramanian, T. Liu, L. Hutin, 2013, 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).

Compact Thermal Model for Vertical Nanowire Phase-Change Memory Cells

I-Ru Chen, E. Pop, E. Pop, 2009, IEEE Transactions on Electron Devices.

Experimental Studies of Contact Detachment Delay in Microrelays for Logic Applications

T. Liu, I. Chen, Chuang Qian, 2015, IEEE Transactions on Electron Devices.

Microelectromechanical Relay and Logic Circuit Design for Zero Crowbar Current

Tsu-Jae King Liu, Chuang Qian, Nuo Xu, 2014, IEEE Transactions on Electron Devices.

Novel Material Integration for Reliable and Energy-Efficient NEM Relay Technology

I-Ru Chen, I. Chen, 2014 .

Multi-input/multi-output relay design for more compact and versatile implementation of digital logic with zero leakage

Tsu-Jae King Liu, Jaeseok Jeon, R. Nathanael, 2012, Proceedings of Technical Program of 2012 VLSI Technology, System and Application.

Relays do not leak - CMOS does

Vladimir Stojanovic, Louis Hutin, Tsu-Jae King Liu, 2013, 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC).

Hybrid CMOS/BEOL-NEMS technology for ultra-low-power IC applications

Tsu-Jae King Liu, Chuang Qian, Nuo Xu, 2014, 2014 IEEE International Electron Devices Meeting.