D. Dutoit

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits

Pascal Vivet, François de Crecy, Didier Lattard, 2016, IEEE Design & Test.

Key requirements for optical interconnects within data centers

D. Dutoit, M. Duranton, S. Menezo, 2017 .

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

Christian Bernard, Fabien Clermidy, Alain Greiner, 2021, IEEE Journal of Solid-State Circuits.

POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems

Christian Bernard, Yvain Thonnart, Pascal Vivet, 2020, 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE).

Memory controllers for high-performance and real-time MPSoCs requirements, architectures, and future trends

Tei-Wei Kuo, Fabien Clermidy, Kees G. W. Goossens, 2011, 2011 Proceedings of the Ninth IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS).

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters

Christian Bernard, Fabien Clermidy, Alain Greiner, 2020, 2020 IEEE International Solid- State Circuits Conference - (ISSCC).

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

Maxime Argoud, Pascal Vivet, Didier Lattard, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Platform 2012, a many-core computing accelerator for embedded SoCs: Performance evaluation of visual analytics applications

Luca Benini, Fabien Clermidy, Eric Flamand, 2012, DAC Design Automation Conference 2012.

ExaNoDe: combined integration of chiplets on active interposer with bare dice in a multi-chip-module for heterogeneous and scalable high performance compute nodes

D. Lattard, P. Vivet, S. Cheramy, 2020, 2020 IEEE Symposium on VLSI Technology.