B. Orlando

A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications

G. Masini, D. Gloria, R. Beneyton, 2013, 2013 IEEE International Electron Devices Meeting.

Gate-All-Around technology: taking advantage of ballistic transport ?

G. Ghibaudo, T. Skotnicki, S. Monfray, 2009, ESSDERC 2009.

MOS Capacitor Deep Trench Isolation for CMOS image sensors

F. Leverd, F. Roy, B. Orlando, 2014, 2014 IEEE International Electron Devices Meeting.

Folded fully depleted FET using Silicon-On-Nothing technology as a highly W-scaled planar solution

C. Laviron, Stephane Monfray, Claire Fenouillet-Beranger, 2009, ESSDERC 2009.