A. Yamada

Role of surface morphology in wafer bonding

W. Maszara, B. Jiang, A. Yamada, 1991 .

Bonding silicon wafer to silicon nitride with spin-on glass as adhesive

A. Yamada, T. Kawasaki, M. Kawashima, 1987 .

Soi by wafer bonding with spin-on glass as adhesive

A. Yamada, T. Kawasaki, M. Kawashima, 1987 .

A selective polishing approach for the fabrication of bonded‐wafer silicon‐on‐insulator

A. Yamada, 1993 .

Direct adhesion of single-crystal GaAs wafers

A. Yamada, M. Kawashima, M. Oasa, 1988 .

Structural Evaluation of Silicon‐on‐Insulator Fabricated by a Direct Wafer Bonding and Numerically Controlled Polishing Technique

B. Jiang, A. Yamada, G. Rozgonyi, 1991 .