B. Majeed

发表

Silicon Based System for Single-Nucleotide-Polymorphism Detection: Chip Fabrication and Thermal Characterization of Polymerase Chain Reaction Microchamber

C. Hoof, N. Tutunjyan, B. Jones, 2012 .

Parylene N as a dielectric material for through silicon vias

E. Beyne, B. Majeed, D. Tezcan, 2008, 2008 58th Electronic Components and Technology Conference.

Micro vapor bubble jet flow for safe and high-rate fluorescence-activated cell sorting.

Dries Vercruysse, Kamil Blaszkiewicz, Liesbet Lagae, 2017, Lab on a chip.

Sloped Through Wafer Vias for 3D Wafer Level Packaging

P. De Moor, B. Majeed, K. Baert, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Diamond scanning probes with sub-nanometer resolution for advanced nanoelectronics device characterization

B. Majeed, W. Vandervorst, T. Nuytten, 2016 .

Electrical characterization, modeling and reliability analysis of a via last TSV

E. Beyne, B. Vandevelde, B. Majeed, 2010, 2010 12th Electronics Packaging Technology Conference.

Study on stair-step liquid triggered capillary valve for microfluidic systems

B. Jones, B. Majeed, T. Stakenborg, 2018 .

Fabrication of an electrostatically actuated impingement cooling device

B. Vandevelde, H. Oprins, B. Jones, 2011 .

Ion-pair reversed-phase chromatography of short double-stranded deoxyribonucleic acid in silicon micro-pillar array columns: retention model and applications.

P. Peumans, C. van Hoof, L. Lagae, 2013, Journal of chromatography. A.

3D stack packaging solution for BAW devices: 3D packaging demonstrator and RF performance

X. Sun, B. Majeed, W. De Raedt, 2011, 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC).

Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias

B. Majeed, P. Soussan, W. Ruythooren, 2007, 2007 European Microwave Conference.

Evaluation of Sn-based microbumping technology for hybrid IR detectors, 10µm pitch to 5µm pitch

B. Majeed, P. Soussan, P. Bouillon, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Microbumping technology for hybrid IR detectors, 10μm pitch and beyond

B. Majeed, P. Soussan, P. Bouillon, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Characterizing stress in ultrathin silicon wafers

B. Majeed, K. Razeeb, J. Barton, 2006 .

An integrated one-chip-sensor system for microRNA quantitative analysis based on digital droplet polymerase chain reaction

P. Fiorini, B. Majeed, T. Stakenborg, 2016 .

High throughput cell sorter based on lensfree imaging of cells

R. Stahl, L. Lagae, G. Vanmeerbeeck, 2015, 2015 IEEE International Electron Devices Meeting (IEDM).

Sub-micro-liter Electrochemical Single-Nucleotide-Polymorphism Detector for Lab-on-a-Chip System

P. Fiorini, Sara Peeters, Ichiro Yamashita, 2012 .

Elution behavior of short dsDNA strands in silicon micropillar array columns in ion pair reversed‐phase chromatography mode

C. van Hoof, B. Majeed, F. Lynen, 2012, Electrophoresis.

Micron-sized pillars for ion-pair reversed-phase DNA separations.

B. Majeed, G. Desmet, W. De Malsche, 2010, Journal of separation science.

Effect of Gold Stud Bump Topology on Reliability of Flip Chip on Flex Interconnects

B. Majeed, K. Razeeb, J. Barton, 2007, IEEE Transactions on Advanced Packaging.

Statistical fracture modelling of silicon with varying thickness

B. Majeed, K. Razeeb, J. Barton, 2006 .

Photoresist coating and patterning for through-silicon via technology

B. Swinnen, B. Majeed, D. Tezcan, 2008 .

Thermo-mechanical design of a generic 0-level MEMS package using chip capping and Through Silicon Via's

E. Beyne, R. Jansen, B. Vandevelde, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

Silicon Based System for Single-Nucleotide-Polymorphism Detection: Chip Fabrication and Thermal Characterization of Polymerase Chain Reaction Microchamber

C. Hoof, N. Tutunjyan, B. Jones, 2012 .

An integrated microsystem for allele-specific PCR amplification of genomic DNA directly from human blood

C. Hoof, B. Jones, P. Fiorini, 2012 .

A SILICON BASED LAB ON A CHIP FOR DIGITAL DROPLET PCR

B. Jones, P. Fiorini, L. Lagae, 2014 .

A Compact Device for Digital Droplet PCR

B. Jones, P. Fiorini, L. Lagae, 2014 .

Process integration solution for damage-free bevel for deep Si etch applications

N. Tutunjyan, P. Fiorini, B. Majeed, 2012 .

Silicon micro-pillar filter fabrication for DNA separation in Lab-on-chip system

N. Tutunjyan, B. Jones, P. Fiorini, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

Silicon Micro-Fabrication Technologies for Micro-Filters

P. Fiorini, B. Majeed, D. Tezcan, 2010 .

Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias

P. Soussan, W. De Raedt, B. Nauwelaers, 2007, 2007 European Microwave Integrated Circuit Conference.

TiN scanning probes for electrical profiling of nanoelectronics device structures

B. Majeed, D. Tezcan, U. Celano, 2012 .

3D Chip Stacking of RF Devices with Cu TSV, Cu/Sn Bumps and Sealing Ring

X. Sun, B. Majeed, C. Eggs, 2011 .

Fabrication and Electrical Evaluation of Via Last Polymer Liner TSVs

E. Beyne, Y. Civale, B. Majeed, 2010 .

Spin-on dielectric liner TSV for 3D wafer level packaging applications

E. Beyne, Y. Civale, B. Majeed, 2010, 2010 IEEE International Interconnect Technology Conference.

Failure Analysis and Process Improvement for Through Silicon Via Interconnects

B. Majeed, D. Tezcan, P. Soussan, 2009 .

Diamond nanoprobes for electrical probing of nanoelectronics device structures

B. Majeed, D. Tezcan, W. Vandervorst, 2014 .

Multiplex SNP genotyping in whole blood using an integrated microfluidic lab-on-a-chip.

M. Fauvart, P. Fiorini, B. Majeed, 2016, Lab on a chip.