Peisheng Liu

发表

Thermal simulation and analysis of intelligent power module (IPM) package

Jinxin Huang, Peisheng Liu, Liangyu Tong, 2012 .

Advances in the Fabrication Processes and Applications of Wafer Level Packaging

Peisheng Liu, Liangyu Tong, Yujuan Tao, 2014 .

Challenges and developments of copper wire bonding technology

Hao Tang, Lei Shi, Peisheng Liu, 2012, Microelectronics and reliability.

Violet photoluminescence from shell layer of Zn∕ZnO core-shell nanoparticles induced by laser ablation

Peisheng Liu, Haibo Zeng, Weiping Cai, 2006 .