C. Koh

发表

Availability of underlayer application to EUV process

Carlos Fonseca, Hyun-Woo Kim, Cha-Won Koh, 2011, Advanced Lithography.

3D Micro‐ and Nanostructures via Interference Lithography

Edwin L. Thomas, Martin Maldovan, Steven E. Kooi, 2007 .

Absorber stack optimization in EUVL masks: lithographic performances in alpha demo tool and other issues

Tae Geun Kim, Han-Ku Cho, Hoon Kim, 2010, Advanced Lithography.

Pushing extreme ultraviolet lithography development beyond 22 nm half pitch

K. Goldberg, C. Koh, P. Naulleau, 2009 .

Nanostructure-induced icephobic sol–gel coating for glass application

C. Koh, M. Qian, L. Wu, 2016, Journal of Sol-Gel Science and Technology.

Lithographic Performances of Non-Chemically Amplified Resist and Chemically Amplified Resist for 193nm Top Surface Imaging Process

Ki-Ho Baik, Cha-Won Koh, C. Koh, 2000 .

Limitation of blend type of resist platform on EUV lithography

Su Min Kim, Taku Hirayama, Hai Sub Na, 2012, Other Conferences.

LWR improvement in EUV resist process

Sumin Kim, Hyun-woo Kim, Cha-Won Koh, 2011, Advanced Lithography.

Characterization of promising resist platforms for sub-30-nm HP manufacturability and EUV CAR extendibility study

Dominic Ashworth, Warren Montgomery, Patrick P. Naulleau, 2010, Advanced Lithography.

Perfluoroalkylated alternating copolymer possessing solubility in fluorous liquids and imaging capabilities under high energy radiation

Hyun-woo Kim, C. Koh, Hyun-Taek Oh, 2021, RSC advances.