Seokjun Hong

发表

Accelerated Publication: Conformal electroless deposition of Cu seed layer on a 60-nm trench pattern modified with a self-assembled monolayer

W. Han, Gil-Ho Hwang, C. Yoon, 2009 .

A review of silicon microfabricated ion traps for quantum information processing

Dong-il Dan Cho, Minjae Lee, Taehyun Kim, 2015 .

Formation of Crumpled Graphene for Flexible Strain Sensor

Seokjun Hong, Taesung Kim, Yinhua Jin, 2017 .

Study on Uniform Deposition on 300 mm Silicon Wafer with Sub-100 nm Sized Particles for Cleaning Application

Seokjun Hong, Taesung Kim, Seungjae Lee, 2021 .

Investigation of a Standard Particle Deposition System on Wafer Surface and Its Application to Wafer Cleaning

Seokjun Hong, Taesung Kim, Jichu Yang, 2019, ECS Journal of Solid State Science and Technology.

Determination of trace amounts of lead and cadmium using a bismuth/glassy carbon composite electrode.

W. Han, Gil-Ho Hwang, Sung-Goon Kang, 2009, Talanta.

A New Microfabrication Method for Ion-Trap Chips That Reduces Exposure of Dielectric Surfaces to Trapped Ions

Seokjun Hong, D. Cho, Minjae Lee, 2018, Journal of Microelectromechanical Systems.

Investigations on the Mechanism of Silica Particle Removal During the Cu Buff Cleaning Process

Peng Liu, Seokjun Hong, Taesung Kim, 2021 .

Investigation of Copper Oxide Ring Formation during Post Chemical Mechanical Polishing Cleaning of Cu Interconnect

Seokjun Hong, Taesung Kim, Yinhua Jin, 2017 .

Preparation and Characteristics of MWNT/SnO 2 Nanocomposites Anode by Colloidal Heterocoagulation for Li-ion Battery

Y. Choa, Sung-tag Oh, W. Han, 2008 .

Effect of Viscosity on Ceria Abrasive Removal during the Buff Clean Process

Seokjun Hong, Taesung Kim, Jaewon Lee, 2020 .

Effect of the Palladium Mid-Layer on the Cyclic Oxidation of Platinum Aluminide Bond Coating

W. Han, Gil-Ho Hwang, Sung-Goon Kang, 2006 .

Fabrication of Cu nano particles by direct electrochemical reduction from CuO nano particles

W. Han, Gil-Ho Hwang, S. J. Hong, 2006 .

A Water Polishing Process to Improve Ceria Abrasive Removal

Seokjun Hong, Taesung Kim, Seung-Ki. Chae, 2019, ECS Journal of Solid State Science and Technology.

Experimental Methods for Trapping Ions Using Microfabricated Surface Ion Traps

Seokjun Hong, D. Cho, Minjae Lee, 2017, Journal of visualized experiments : JoVE.

Improvement of oxide removal rate in chemical mechanical polishing by forming oxygen vacancy in ceria abrasives via ultraviolet irradiation

Seokjun Hong, Taesung Kim, Hyeong-U. Kim, 2021 .

Synthesis of Zn–Mg coatings using unbalanced magnetron sputtering and theirs corrosion resistance

Seokjun Hong, JoungHyun La, Sang-Yul Lee, 2014 .

Engineering of microfabricated ion traps and integration of advanced on-chip features

Seokjun Hong, Martin Siegele, Zak David Romaszko, 2019, 1908.00267.

Tangential flow filtration of ceria slurry: Application of a single-pass method to improve buff cleaning

Peng Liu, Seokjun Hong, Jae-Whoan Lee, 2022, Materials Science in Semiconductor Processing.

Guidelines for Designing Surface Ion Traps Using the Boundary Element Method

Minjae Lee, Dong-Il Cho, Seokjun Hong, 2016, Sensors.

Study on Abnormally Accelerated Oxidation of Tungsten Plugs during Tungsten Chemical Mechanical Polishing in Semiconductor Manufacturing

Seokjun Hong, Pengzhan Liu, Taesung Kim, 2021 .

Direct Electrochemical Reduction of CuO Nano Particles to Cu Nano Particles in NaCl Solution

Gil-Ho Hwang, Sung-Goon Kang, Seokjun Hong, 2005 .

A review of silicon microfabricated ion traps for quantum information processing

Seokjun Hong, D. Cho, Minjae Lee, 2015 .

Investigation of the pad-conditioning performance deterioration in the chemical mechanical polishing process

Seokjun Hong, Taesung Kim, Yinhua Jin, 2017 .

Investigation of abrasive-free slurry for polysilicon buffing chemical mechanical planarization

Seokjun Hong, Kihong Park, Taesung Kim, 2021 .

Communication—Effect of Hydrogen Water on Ceria Abrasive Removal in Post-CMP Cleaning

Seokjun Hong, Pengzhan Liu, Taesung Kim, 2020 .

Investigation of abrasive behavior between pad asperity and oxide thin film in chemical mechanical planarization

Peng Liu, Seokjun Hong, Kihong Park, 2022, Materials Science in Semiconductor Processing.

Communication—A Novel Method to Improve Cleaning Performance by Removing Small Particles in CMP Slurry

Peng Liu, Seokjun Hong, Taesung Kim, 2021 .