P. Engel

发表

Impact Wear of Materials

F. F. Ling, P. Engel, 1976 .

Principles of electronic packaging

P. Engel, D. Seraphim, R. Lasky, 1989 .

Thermal Stress and Strain in Microelectronics Packaging

J. Lau, P. Engel, J. Lau, 1993 .

Solder Joint Reliability: Theory And Applications

J. Lau, Peter A. Engel, J. Lau, 2014 .

Plated Holes in Cards and Boards

P. Engel, 1993 .

Thermal Stresses in Compliant Leaded Systems

P. Engel, 1993 .

Tribology and Mechanics of Magnetic Storage Devices

Bharat Bhushan, Peter A. Engel, P. Engel, 1990 .

Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1

Avram Bar-Cohen, Allan D. Kraus, Peter A. Engel, 1988 .

Dynamic Response of Circuit Card Systems

P. Engel, 1993 .

Failure models for mechanical wear modes and mechanisms

P. A. Engel, P. Engel, 1993 .

Torsional stiffness and fatigue study of surface-mounted compliant leaded systems

P. Engel, T. Miller, 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

Leadless Chip Carriers

P. Engel, 1993 .

Thermal Stress in Pin-Grid Arrays: Interaction Between Module and Circuit Card

P. Engel, 1993 .

Stress Analysis for Component-Populated Circuit Cards

Peter A. Engel, P. Engel, 1991 .

Mechanical aspects of second level packaging interconnection methods

P. A. Engel, P. Engel, 1990, IEEE International Symposium on Circuits and Systems.

COMPRESSION OF BONDED ANNULAR RUBBER BLOCKS

P. Engel, Y. Ling, W. Brodsky, 1995 .

Impact of Delrin disc: lubricated and dry contacts

P. Engel, Zheming Zhao, 1996 .

Components, Data, and Testing

Peter A. Engel, P. Engel, 1993 .