R. Dudek
发表
Rainer Dudek,
Sven Rzepka,
Jan Albrecht,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel,
R. Dudek,
R. Doering,
2008
.
R. Dudek,
S. Rzepka,
R. Schaller,
2017,
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
M. Wolf,
B. Wunderle,
R. Dudek,
2018,
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
H. Reichl,
R. Dudek,
A. Schubert,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
B. Michel,
R. Dudek,
J. Vogel,
2004
.
B. Michel,
R. Dudek,
H. Walter,
2001,
Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).
Low-cycle Fatigue of Ag-Based Solders Dependent on Alloying Composition and Thermal Cycle Conditions
B. Michel,
R. Dudek,
W. Faust,
2007,
2007 9th Electronics Packaging Technology Conference.
H. Reichl,
B. Michel,
R. Dudek,
1997,
1997 Proceedings 47th Electronic Components and Technology Conference.
H. Reichl,
B. Michel,
R. Dudek,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders
B. Michel,
R. Dudek,
M. Spraul,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
R. Dudek,
S. Rzepka,
R. Doering,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
B. Michel,
R. Dudek,
B. Michel,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
R. Dudek,
2006
.
B. Michel,
R. Dudek,
M. Roellig,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
B. Michel,
R. Dudek,
W. Faust,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
B. Michel,
R. Dudek,
H. Walter,
2001,
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
B. Michel,
R. Dudek,
J. Auersperg,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
B. Michel,
R. Dudek,
J. Auersperg,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
R. Doring,
S. Rzepka,
R. Dudek,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
R. Dudek,
S. Rzepka,
J. Wilde,
2021,
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
R. Dudek,
S. Rzepka,
D. Vogel,
2018
.
R. Dudek,
S. Rzepka,
G. Mitic,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
R. Dudek,
S. Rzepka,
M. Hildebrandt,
2016,
2016 6th Electronic System-Integration Technology Conference (ESTC).
H. Reichl,
B. Michel,
R. Dudek,
2003,
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
R. Dudek,
S. Rzepka,
M. Rollig,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
B. Michel,
R. Dudek,
S. Rzepka,
2013,
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
B. Michel,
R. Dudek,
J. Auersperg,
2006
.
J. Albrecht,
R. Dudek,
S. Rzepka,
2019,
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
Bernd Michel,
Rainer Dudek,
Dietmar Vogel,
1996
.
Bernd Michel,
Rainer Dudek,
Sven Rzepka,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
R. Pufall,
B. Seiler,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel,
R. Dudek,
J. Auersperg,
2010,
2010 12th Electronics Packaging Technology Conference.
Rainer Dudek,
B. Michel,
B. Michel,
2000
.
Bernd Michel,
Rainer Dudek,
C. Birzer,
1998,
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
Rainer Dudek,
Rainer Tilgner,
P. Alpern,
2002
.
B. Michel,
R. Dudek,
H. Walter,
2001,
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
M. Scherzer,
R. Dudek,
A. Schubert,
1997,
Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).
J. Albrecht,
R. Dudek,
S. Rzepka,
2022,
Microelectronics Reliability.
J. Albrecht,
R. Dudek,
S. Rzepka,
2020,
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Michel,
R. Dudek,
J. Auersperg,
2007,
Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
B. Michel,
R. Dudek,
J. Auersperg,
2006,
EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
B. Michel,
B. Seiler,
R. Dudek,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
B. Michel,
R. Dudek,
O. Wittler,
2006,
2006 8th Electronics Packaging Technology Conference.
R. Dudek,
G. Schrag,
M. Hildebrandt,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
H. Reichl,
B. Wunderle,
B. Michel,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
B. Michel,
R. Dudek,
B. Michel,
1994,
Proceedings of 1994 IEEE International Reliability Physics Symposium.
B. Michel,
R. Dudek,
H. Walter,
2002,
2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617).
H. Reichl,
B. Michel,
A. Schubert,
1997,
Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces.
R. Dudek,
O. Wittler,
R. Mrossko,
2010
.
D. Vogel,
B. Michel,
J. Auersperg,
2008,
2008 10th Electronics Packaging Technology Conference.
Michael Goroll,
Reinhard Pufall,
Rainer Dudek,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Rainer Dudek,
Rainer Tilgner,
Kheng Chooi Lee,
2002
.
Jonas Johansson,
Ilja Belov,
Erland Johnson,
2014,
Microelectron. Reliab..
W. Kanert,
R. Pufall,
R. Dudek,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
R. Dudek,
S. Rzepka,
M. Hutter,
2015,
2015 European Microelectronics Packaging Conference (EMPC).
R. Doring,
B. Seiler,
R. Dudek,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Rzepka,
B. Michel,
R. Dudek,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Wiese,
R. Doring,
S. Rzepka,
2006,
2006 1st Electronic Systemintegration Technology Conference.
S. Rzepka,
B. Seiler,
R. Döring,
2018,
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
R. Dudek,
S. Rzepka,
A. Otto,
2022,
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Michel,
R. Dudek,
S. Rzepka,
2012,
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
R. Dudek,
S. Rzepka,
A. Otto,
2023,
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Vandevelde,
R. Dudek,
S. Rzepka,
2021,
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
J. Albrecht,
R. Dudek,
S. Rzepka,
2020,
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
R. Dudek,
S. Rzepka,
A. Otto,
2022,
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
C. P. Wong,
H. Reichl,
Jianmin Qu,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
B. Michel,
R. Dudek,
J. Auersperg,
2000
.
Rainer Dudek,
Łukasz Dowhań,
Artur Wymysłowski,
2009
.
Artur Wymyslowski,
Rainer Dudek,
Lukasz Dowhan,
2008,
Microelectron. Reliab..