J. Auersperg

发表

Rainer Dudek, Sven Rzepka, Jan Albrecht, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel, R. Dudek, J. Auersperg, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
B. Michel, J. Auersperg, S. Rzepka, 2011, 2011 IEEE International Interconnect Technology Conference.
B. Michel, R. Dudek, J. Auersperg, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel, J. Auersperg, D. Vogel, 2010, 3rd Electronics System Integration Technology Conference ESTC.
H. Reichl, B. Michel, R. Dudek, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
B. Michel, J. Auersperg, 2007, 2007 9th Electronics Packaging Technology Conference.
B. Michel, R. Dudek, J. Auersperg, 2006 .
B. Michel, J. Auersperg, D. Vogel, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
B. Michel, J. Auersperg, D. Vogel, 2013 .
B. Michel, J. Auersperg, D. Vogel, 2009, Electronic Packaging Technology Conference.
B. Michel, J. Auersperg, D. Vogel, 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
J. Auersperg, S. Rzepka, E. Kaulfersch, 2015, 2015 European Microelectronics Packaging Conference (EMPC).
Bernd Michel, Rainer Dudek, Sven Rzepka, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle, R. Pufall, B. Seiler, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel, R. Dudek, J. Auersperg, 2010, 2010 12th Electronics Packaging Technology Conference.
B. Michel, R. Dudek, J. Auersperg, 2007, Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
B. Michel, J. Auersperg, B. Michel, 2007, 2007 8th International Conference on Electronic Packaging Technology.
B. Michel, R. Dudek, J. Auersperg, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
B. Michel, B. Seiler, R. Dudek, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
B. Michel, A. Schubert, E. Kieselstein, 2001, First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
B. Michel, B. Wunderle, J. Auersperg, 2003, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.
H. Reichl, B. Michel, J. Auersperg, 1997, Application of Fracture Mechanics in Electronic Packaging.
B. Michel, J. Auersperg, B. Michel, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
B. Michel, D. Vogel, J. Auersperg, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
D. Vogel, B. Michel, J. Auersperg, 2008, 2008 10th Electronics Packaging Technology Conference.
Bernd Michel, Dietrich R. T. Zahn, Sven Rzepka, 2014, Microelectron. Reliab..
B. Michel, G. Fischerauer, E. Kieselstein, 1998, IECON '98. Proceedings of the 24th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.98CH36200).
B. Michel, J. Auersperg, D. Vogel, 1998, 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225).
B. Michel, R. Dudek, J. Auersperg, 2000 .