E. Liao
发表
G. Lo,
D. Kwong,
Q.X. Zhang,
2006,
2006 International Electron Devices Meeting.
M. F. Chen,
C. T. Wang,
Douglas C. H. Yu,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
E.B. Liao,
N. Balasubramanian,
L.H. Guo,
2008,
IEEE Transactions on Electron Devices.
W. H. Teh,
E. Liao,
R. Kumar,
2006
.
V. Kripesh,
S. Ang,
E. Liao,
2005,
2005 7th Electronic Packaging Technology Conference.
G. Lo,
V. Kripesh,
S. Ang,
2009,
IEEE Transactions on Advanced Packaging.
E. Liao,
B. Luo,
Y. Guo,
2008,
2008 Asia-Pacific Microwave Conference.
V. Kripesh,
S. Ang,
E. Liao,
2006,
IEEE Transactions on Components and Packaging Technologies.
G. Lo,
D. Kwong,
A. Yu,
2008
.
Xiaowu Zhang,
V. Kripesh,
N. Khan,
2010,
IEEE Transactions on Components and Packaging Technologies.
G. Lo,
D. Kwong,
E. Liao,
2008,
IEEE Electron Device Letters.
Tai Chong Chai,
Shiguo Liu,
Yue Ying Ong,
2011,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
C.H. Chang,
T.J. Wu,
W.C. Chiou,
2010,
2010 International Electron Devices Meeting.