R. Kumar
发表
G. Lo,
D. Kwong,
Q.X. Zhang,
2006,
2006 International Electron Devices Meeting.
S.C. Rustagi,
R. Kumar,
N. Balasubramanian,
2006,
IEEE Electron Device Letters.
S. Balakumar,
K. Buddharaju,
N. Singh,
2009
.
W. H. Teh,
E. Liao,
R. Kumar,
2006
.
V. Kripesh,
S. Ang,
E. Liao,
2005,
2005 7th Electronic Packaging Technology Conference.
S. Balakumar,
G. Lo,
D. Kwong,
2007,
2006 European Solid-State Device Research Conference.
S. Balakumar,
G. Lo,
D. Kwong,
2006,
IEEE Electron Device Letters.
S. Balakumar,
G. Lo,
D. Kwong,
2006
.
G. Lo,
V. Kripesh,
S. Ang,
2009,
IEEE Transactions on Advanced Packaging.
G. Lo,
D. Kwong,
D. Chi,
2005,
IEEE Electron Device Letters.
S. Balakumar,
G. Lo,
D. Kwong,
2008
.
S. Balakumar,
G. Lo,
D. Kwong,
2006,
2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits.
S. Balakumar,
G. Lo,
D. Kwong,
2006,
2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits.
Cheng Soon Ong,
S. Balakumar,
G. Lo,
2006
.