J. Bommels

发表

S. Demuynck, G. Groeseneken, K. Croes, 2013, 2013 IEEE International Reliability Physics Symposium (IRPS).

Variability of quadruple-patterning interconnect processes

Christopher J. Wilson, V. V. Gonzalez, J. Ryckaert, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

High-Aspect-Ratio Ruthenium Lines for Buried Power Rail

Christopher J. Wilson, C. Adelmann, N. Heylen, 2018, 2018 IEEE International Interconnect Technology Conference (IITC).

Thickness dependence of the resistivity of platinum-group metal thin films

K. Sankaran, G. Pourtois, C. Adelmann, 2017, 1701.04124.

Correlation between field dependent electrical conduction and dielectric breakdown in a SiCOH based low-k (k = 2.0) dielectric

I. De Wolf, Ivan Ciofi, Y Yohan Barbarin, 2013 .

Effect of line-overlay and via-misalignment on dielectric reliability for different patterning schemes

K. Croes, J. Bommels, Z. Tokei, 2014, 2014 IEEE International Reliability Physics Symposium.

Reliability mechanisms and lifetime extrapolation methods for scaled interconnect technologies

K. Croes, J. Bommels, Z. Tokei, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Scalability of RuTiN barriers deposited by plasma-enhanced atomic layer deposition for advanced interconnects

K. Opsomer, J. Swerts, J. Bommels, 2014 .

In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures

K. Croes, J. Bommels, Z. Tokei, 2014 .

CVD-Mn/CVD-Ru-based barrier/liner solution for advanced BEOL Cu/Low-k interconnects

M. H. van der Veen, K. Croes, N. Jourdan, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies

K. Croes, S. Demuynck, Marleen H. van der Veen, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Ruthenium metallization for advanced interconnects

Christopher J. Wilson, Christoph Adelmann, Nancy Heylen, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Direct etched Cu characterization for advanced interconnects

K. Croes, F. Lazzarino, J. Bommels, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Impact of Via Density on the Mechanical Integrity of Advanced Back-End-of-Line During Packaging

Eric Beyne, Ingrid De Wolf, Mario Gonzalez, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Semi-empirical interconnect resistance model for advanced technology nodes: A model apt for materials selection based upon test line resistance measurements

G. Groeseneken, R. Degraeve, D. Linten, 2016, 2016 IEEE International Reliability Physics Symposium (IRPS).

Barrier/liner stacks for scaling the Cu interconnect metallization

M. H. van der Veen, V. V. Gonzalez, K. Croes, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Towards the understanding of intrinsic degradation and breakdown mechanisms of a SiOCH low-k dielectric

K. Croes, I. De Wolf, T. Kauerauf, 2014, 2014 IEEE International Reliability Physics Symposium.

Low field TDDB of BEOL interconnects using >40 months of data

K. Croes, Y. Barbarin, Ph Roussel, 2013, 2013 IEEE International Reliability Physics Symposium (IRPS).