R. Doering

Simulation based analysis of secondary effects on solder fatigue

B. Michel, R. Dudek, R. Doering, 2008 .

Solder fatigue acceleration prediction and testing results for different thermal test- and field cycling environments

R. Dudek, S. Rzepka, R. Doering, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).

Thermal fatigue modelling for SnAgCu and SnPb solder joints

B. Michel, R. Dudek, B. Michel, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Delamination modeling for power packages by the cohesive zone approach

B. Michel, R. Dudek, S. Rzepka, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.