T. Nishio

Compact Modeling Approach using GA for Accurate Thermal Simulation.

Koji Koyamada, Toshihiko Nishio, Hidetoshi Kotera, 1999 .

A thermal compact modeling method using Response Surface Methodology with Genetic Algorithm

Koji Koyamada, Toshihiko Nishio, Masanori Kuzuno, 2000, PDPTA.

Volume visualization of 3D finite element method results

Koji Koyamada, T. Nishio, K. Koyamada, 1991, IBM J. Res. Dev..

Electronic packaging gears up for 5G mobile race

Toshihiko Nishio, T. Nishio, 2017, 2017 International Conference on Electronics Packaging (ICEP).

Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps

Yasumitsu Orii, Toshihiko Nishio, Claudius Feger, 2009, 2009 59th Electronic Components and Technology Conference.

Injection molded solder - A new fine pitch substrate bumping method

H. Noma, T. Nishio, D. Shih, 2009, 2009 59th Electronic Components and Technology Conference.

Compact modeling approach using genetic algorithms for accurate thermal simulation

Koji Koyamada, Toshihiko Nishio, Hidetoshi Kotera, 2001 .