Daquan Yu

发表

Development of through glass tungsten via interconnect for 3D MEMS packaging

L. Wan, Yu Sun, Daquan Yu, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

The development of low cost Through Glass Via (TGV) interposer using additive method for via filling

L. Wan, Yu Sun, Daquan Yu, 2012 .

for high performance processer

Daquan Yu, Haiyan Liu, Feng Jiang, 2015 .

Low temperature wafer level conformal polymer dielectric spray coating for through silicon vias with 2:1 aspect ratio

Daquan Yu, Fengwei Dai, Yuechen Zhuang, 2016 .

Development of 3D Thin WLCSP Using Vertical Via Last TSV Technology with Various Temporary Bonding Materials and Low Temperature PECVD Process

Wei Zhang, Daquan Yu, Zhiyi Xiao, 2016, Electronic Components and Technology Conference.

Spray coating process with polymer material for insulation in CIS-TSV wafer-level-packaging

Daquan Yu, Fengwei Dai, Guoping Zhang, 2014, 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy.

Investigate the microstructure changes in Cu through-silicon vias (TSVs) under thermal process

Daquan Yu, Chongshen Song, Zhang Zhaoqiang, 2012 .

Integration of CMOS Image Sensor and Microwell Array Using 3-D WLCSP Technology for Biodetector Application

Daquan Yu, Chaodong Yang, F. Qin, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

A study of electrical character of 3D high-density junction capacitor for SiP

Liqiang Cao, L. Wan, Daquan Yu, 2012 .

The development of wafer-level 3D high-density junction capacitor for passive device integration in SiP

Liqiang Cao, L. Wan, Daquan Yu, 2012, 2012 4th Electronic System-Integration Technology Conference.

Three-dimensional PN junction capacitor for passive integration

Liqiang Cao, D. Guidotti, L. Wan, 2011 .

Development of new TSV structure composing of intermetallic compounds

X. Jing, L. Wan, Yu Sun, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

Reliability of Ultra-Thin Embedded Silicon Fan-Out (eSiFO) Package Directly Assembled on PCB for Mobile Applications

Lixi Wan, Daquan Yu, Zhiyi Xiao, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Thermal analysis and heat dissipation optimization of 3D packaging with TSV interposer

Jun Wang, Daquan Yu, Daquan Yu, 2012 .

Development and reliability study of 3D WLCSP for CMOS image sensor using vertical TSVs with 3:1 aspect ratio

Daquan Yu, Fengwei Dai, Zhiyi Xiao, 2017 .

3D wafer level compression molding process development for image sensor package

Daquan Yu, Zhiyi Xiao, Xiaohua Huang, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Low thermal resistance design for a 2.5D package

Daquan Yu, Xiaoyang Liu, He Ma, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Development of micro-alloying method for Cu pillar solder bump by solid liquid interaction

L. Wan, Daquan Yu, Fengwei Dai, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Newly developed in-situ formation of SnAg and SnAgCu solder on copper pillar bump

L. Wan, Daquan Yu, Fengwei Dai, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Development and Reliability study of 3D WLCSP for automotive CMOS image sensor using TSV technology

Daquan Yu, Xiaobing Yang, Shuying Ma, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Modeling, simulation and analysis of coplanar waveguide on glass substrate for 2.5D integration

Daquan Yu, D. Shangguan, Wenya Shang, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Development of three-dimensional wafer level chip scale packaging using via last TSV and UV laser releasable temporary bonding technologies

Daquan Yu, Shuying Ma, Chengqian Wang, 2021, Microsystem Technologies.

Effect of thermal annealing on TSV Cu protrusion and local stress

Chongshen Song, Liqiang Cao, Cheng Xu, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter

Daquan Yu, Zuohuan Chen, Yi Zhong, 2022, Sensors.

Enhancement of inductance and quality factor of solenoid inductor by Integrating Printing magnetic film On glass wafer

Daquan Yu, Zhihui Hu, Haozhe Ma, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

An Objective Train Timetabling Quality Evaluation Method

Daquan Yu, S. Ni, Feng Jiang, 2017 .

Properties and electric characterizations of tetraethyl orthosilicate-based plasma enhanced chemical vapor deposition oxide film deposited at 400 °C for through silicon via application

X. Jing, D. Guidotti, L. Wan, 2014 .

3D modeling and simulation of heat transfer for internal channel cooling of 3D-chip stacks

Liqiang Cao, D. Guidotti, L. Wan, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Selective metallization of glass with improved adhesive layer and optional hydrophobic surface

R. Sun, Daquan Yu, Guoping Zhang, 2021 .

Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs

Daquan Yu, N. Zhao, Haitao Ma, 2018, Journal of Electronic Materials.

An experimental verified model for Cu electrodeposition simulation for the filling of high aspect ratio through silicon vias

L. Wan, Daquan Yu, Chongshen Song, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Warpage Prediction and Optimization for Embedded Silicon Fan-Out Wafer-Level Packaging Based on an Extended Theoretical Model

Cheng Chen, Lixi Wan, Teng Wang, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps

Daquan Yu, N. Zhao, Haitao Ma, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

The Formation of Cn-Sn IMC Interconnection by Solid-Liquid Interdiffusion Bonding for 3D Glass Wafer Stacking

Daquan Yu, Mingchuan Zhang, Kuili Ren, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

Development and reliability study of 3D WLCSP for CMOS image sensor using vertical TSVs with 3:1 aspect ratio

Daquan Yu, Fengwei Dai, Zhiyi Xiao, 2017, Microsystem Technologies.

Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology

Daquan Yu, Feng Jiang, Zuohuan Chen, 2022, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Temperature-dependant thermal stress analysis of through-silicon-vias during manufacturing process

X. Jing, L. Wan, Daquan Yu, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Warpage Investigation of Fan-Out Wafer-Level Packaging With Novel Thermosetting Films

Daquan Yu, Wei Li, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Experimental and Numerical Investigations of the Warpage of Fan-Out Wafer-Level Packaging With SAW Filters

Daquan Yu, Wei Li, 2022, IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Electrical performance characterization of glass substrate for millimeter-wave applications

Daquan Yu, Tian Yu, 2023, Journal of Materials Science: Materials in Electronics.

Investigation of low-cost through glass vias formation on borosilicate glass by picosecond laser-induced selective etching

Daquan Yu, Li Chen, 2021, Journal of Materials Science: Materials in Electronics.

Development of a Reliable High-Performance WLP for a SAW Device

Daquan Yu, Zuohuan Chen, 2022, Sensors.

Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs

Daquan Yu, N. Zhao, Haitao Ma, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Warpage Characteristic of Glass Interposer with Different CTE's and Thickness

Daquan Yu, F. Qin, Shuai Zhao, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

Development and Reliability Study of 3-D Wafer Level Packaging for SAW Filter Using Thin Film Capping

Daquan Yu, Mingchuan Zhang, Feng Jiang, 2021, IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application

Ming Li, Tianshen Zhou, Shuying Ma, 2020, Sensors.

Study of Warpage Evolution and Control for Six-Side Molded WLCSP in Different Packaging Processes

Fei Qin, Shuai Zhao, Yanwei Dai, 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Synergistic Effect of Additives on Filling of Tapered TGV Vias by Copper Electroplating

Daquan Yu, Huiqin Ling, Ming Li, 2020, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

Design and Fabrication of High-Q IPDS for Process Design Kits on Glass Substrate

Daquan Yu, Zhihui Hu, Haozhe Ma, 2022, 2022 China Semiconductor Technology International Conference (CSTIC).

Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration

Daquan Yu, N. Zhao, Haitao Ma, 2017, Journal of Materials Science: Materials in Electronics.

Development of wafer level hybrid bonding process using photosensitive adhesive and Cu pillar bump

Daquan Yu, N. Zhao, Haitao Ma, 2017, 2017 China Semiconductor Technology International Conference (CSTIC).

Reliability Study of WLP for SAW Filter with Through Film Vias Using Laser Drilling technology

Daquan Yu, Zuohuan Chen, Jiqin Zhang, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Development of 3D Wafer Level Package for SAW Filters Using Thin Film Lamination

Daquan Yu, Mingchuan Zhang, Feng Jiang, 2020, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection

Daquan Yu, F. Qin, Zuohuan Chen, 2022, Micromachines.

Embedded Silicon Fan-Out (eSiFO): A Promising Wafer Level Packaging Technology for Multi-chip and 3D System Integration

Daquan Yu, Zhiyi Xiao, Shuying Ma, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Characteristics of 10–110GHz Transmission Lines on Fused Silica Substrate for Millimeter-wave Modules

Daquan Yu, K. Xue, Yi-Chung Liang, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

The Redistribution Layer-First Embedded Fan-Out Wafer Level Packaging for 2-D Ultrasonic Transducer Arrays

L. Wan, Daquan Yu, Zhiqiang Zhang, 2021, IEEE Electron Device Letters.

Systematic studies of second level interconnection reliability of edge and corner bonded lead-free array-based packages under mechanical and thermal loading

Toshitsugu Ueda, Daquan Yu, Hongbin Shi, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Uniformity improvement of deep silicon cavities fabricated by plasma etching with 12-inch wafer level

Daquan Yu, Zihan Dong, Yuanwei Lin, 2019, Journal of Micromechanics and Microengineering.

Low Temperature Bonding Polycrystalline Diamond to Si by Using Au Thin-layer for High-power Semiconductor Devices

Daquan Yu, Mingchuan Zhang, Shuchao Bao, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

Numerical simulation and experimental verification of copper plating with different additives for through silicon vias

X. Jing, L. Wan, Daquan Yu, 2012, 2012 4th Electronic System-Integration Technology Conference.

Development of Wafer Level Process for the Fabrication of Advanced Capacitive Fingerprint Sensors Using Embedded Silicon Fan-Out (eSiFO(R)) Technology

P. Li, Daquan Yu, Xiaobing Yang, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Development of 3D WLCSP with Black Shielding for Optical Finger Print Sensor for the Application of Full Screen Smart Phone

Daquan Yu, Zhiyi Xiao, Yichao Zou, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Embedded Si Fan Out: A Low Cost Wafer Level Packaging Technology without Molding and De-Bonding Processes

Li Yang, Daquan Yu, Zhiyi Xiao, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

The effect of temporary bonding on post processing in TSV interposer manufacturing

X. Jing, Daquan Yu, Haiyan Liu, 2015 .

A new 2.5D TSV package assembly approach

Lixi Wan, Wen Yin, Daquan Yu, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Deep dry etching of fused silica using C4F8/Ar inductively coupled plasmas

Liqiang Cao, X. Jing, Daquan Yu, 2016, Journal of Materials Science: Materials in Electronics.

Simulation research on wafer warpage and internal stress in the First Passivation process of eSiFO package

Daquan Yu, F. Qin, Huiping Yu, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).