R. He
发表
The development of low cost Through Glass Via (TGV) interposer using additive method for via filling
L. Wan,
Yu Sun,
Daquan Yu,
2012
.
Kornelius Nielsch,
R. He,
K. Nielsch,
2018
.
Liqiang Cao,
L. Wan,
Daquan Yu,
2012,
2012 4th Electronic System-Integration Technology Conference.
X. Jing,
L. Wan,
Yu Sun,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
T. Suga,
R. He,
A. Yamauchi,
2018
.
R. He,
Lifeng Ma,
B. Shaw,
2013
.
T. Suga,
R. He,
M. Fujino,
2015
.
R. He,
Liang Yang,
B. Malomo,
2020
.
T. Suga,
R. He,
F. Mu,
2018,
Materialia.
J. Friedrich,
R. He,
K. Nielsch,
2021,
ACS applied materials & interfaces.
R. He,
Peng Wang,
L. Qiao,
2021,
Spectrochimica Acta Part B: Atomic Spectroscopy.
T. Suga,
R. He,
F. Mu,
2018,
Scripta Materialia.