Fengwei Dai
发表
The development of low cost Through Glass Via (TGV) interposer using additive method for via filling
L. Wan,
Yu Sun,
Daquan Yu,
2012
.
Liqiang Cao,
Fengwei Dai,
Fengman Liu,
2017
.
Daquan Yu,
Fengwei Dai,
Yuechen Zhuang,
2016
.
Daquan Yu,
Fengwei Dai,
Guoping Zhang,
2014,
2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy.
Fengwei Dai,
Rui Cao,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Liqiang Cao,
D. Guidotti,
L. Wan,
2011
.
X. Jing,
L. Wan,
Yu Sun,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
Daquan Yu,
Fengwei Dai,
Zhiyi Xiao,
2017
.
X. Jing,
Fengwei Dai,
Wenqi Zhang,
2014,
2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy.
L. Wan,
Daquan Yu,
Fengwei Dai,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
L. Wan,
Daquan Yu,
Fengwei Dai,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
Development of silicon interposer: towards an ultralow radioactivity background photodetector system
Liqiang Cao,
Fengwei Dai,
L. Wen,
2022,
2207.09174.
Liqiang Cao,
Fengwei Dai,
Qidong Wang,
2022,
Journal of Lightwave Technology.
X. Jing,
D. Guidotti,
L. Wan,
2014
.
S. Alamgir,
Fengwei Dai,
L. Yang,
1999
.
Ming Li,
Liqiang Cao,
Fengwei Dai,
2018,
Journal of Materials Science: Materials in Electronics.
Liqiang Cao,
Fengwei Dai,
D. Zhang,
2022,
IEICE Electron. Express.
Liqiang Cao,
X. Jing,
Fengwei Dai,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Liqiang Cao,
X. Jing,
Fengwei Dai,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Daquan Yu,
Fengwei Dai,
Zhiyi Xiao,
2017,
Microsystem Technologies.
Liqiang Cao,
Fengwei Dai,
Qidong Wang,
2022,
IEEE Transactions on Nuclear Science.
Liqiang Cao,
Fengwei Dai,
Yangyang Yan,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
Liqiang Cao,
Fengwei Dai,
Qidong Wang,
2022,
Processes.
X. Jing,
L. Wan,
Daquan Yu,
2012,
2012 4th Electronic System-Integration Technology Conference.
David-Wei Zhang,
Liqiang Cao,
Fengwei Dai,
2018,
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Shuhui Yu,
S. Luo,
Junyi Yu,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).