M. Hodes
发表
Kenneth A. Smith,
J. Tester,
P. A. Marrone,
2004
.
Kenneth A. Smith,
J. Tester,
P. A. Marrone,
2004
.
M. Hodes,
Elizabeth Brownell,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
M. Hodes,
S. Garimella,
T. Salamon,
2010,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
M. Hodes,
V. P. Manno,
M. Cleary,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
M. Hodes,
M. Hodes,
Elizabeth Brownell,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
S. Garimella,
T. Salamon,
P. Kolodner,
2010,
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
K. Goodson,
M. Hodes,
A.M. Pettes,
2009,
IEEE Transactions on Advanced Packaging.
Randy D. Weinstein,
Marc Hodes,
M. Hodes,
2002
.
T. Salamon,
P. Kolodner,
M. Hodes,
2005
.
Longitudinal-Fin Heat Sink Optimization Capturing Conjugate Effects Under Fully Developed Conditions
M. Hodes,
Georgios Karamanis,
2016
.
Mark T. North,
Ronan Grimes,
Martin Cleary,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Avram Bar-Cohen,
Marc Hodes,
M. Hodes,
1994
.
P. Kolodner,
M. Hodes,
I. Ewes,
2007,
IEEE Transactions on Components and Packaging Technologies.
M. Hodes,
A. Bar-Cohen,
G. Sherwood,
1994,
Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM).
M. Hodes,
R. Enright,
L. Lam,
2013
.
T. Salamon,
P. Kolodner,
M. Hodes,
2006
.
M. Hodes,
M. Cleary,
V. Manno,
2014
.
M. Hodes,
Georgios Karamanis,
Toby L. Kirk,
2017
.
M. Bazant,
M. Hodes,
Toby L. Kirk,
2022,
2211.13751.
S. MacLachlan,
M. Hodes,
Georgios Karamanis,
2017,
Journal of Fluid Mechanics.
S. MacLachlan,
M. Hodes,
A. Cowley,
2015
.
M. Hodes,
2010,
IEEE Transactions on Components and Packaging Technologies.
Kenneth A. Smith,
P. Griffith,
M. Hodes,
2002
.
M. Hodes,
1998
.
Kenneth A. Smith,
P. Griffith,
M. Hodes,
2003
.
Evelyn N Wang,
Marc Hodes,
Paul Kolodner,
2007,
Langmuir : the ACS journal of surfaces and colloids.
M. Hodes,
R. Enright,
C. Melnick,
2014
.
S. Krishnan,
M. Hodes,
D. Hernon,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Wilcoxon,
M. Hodes,
M. Hodes,
2012,
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Marc Hodes,
M. Hodes,
Kyoung-Joon Kim,
2009,
2009 15th International Workshop on Thermal Investigations of ICs and Systems.
Suresh V. Garimella,
Niru Kumari,
Marc Hodes,
2010
.
Suresh V. Garimella,
Marc Hodes,
Niru Kumari,
2009
.
V. Bahadur,
S.V. Garimella,
S. Krishnan,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
S. MacLachlan,
M. Hodes,
Georgios Karamanis,
2016
.
T. Salamon,
M. Hodes,
Y. Muzychka,
2014
.
J. Ashley Taylor,
Marc Hodes,
Paul Kolodner,
2005,
Bell Labs Technical Journal.
M. Hodes,
E. Keaveny,
D. Papageorgiou,
2017
.
M. Hodes,
A. Lyons,
Stuart Mueller,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
M. Hodes,
M. Hodes,
2007,
IEEE Transactions on Components and Packaging Technologies.
Mark T. North,
Ronan Grimes,
Martin Cleary,
2006
.
Rui Zhang,
Marc Hodes,
Ross Wilcoxon,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Kenneth S. Breuer,
Marc Hodes,
Paul Kolodner,
2006
.
D. Crowdy,
M. Hodes,
Georgios Karamanis,
2020,
Journal of Fluid Mechanics.
M. Hodes,
M. Hodes,
2005,
IEEE Transactions on Components and Packaging Technologies.
Shankar Krishnan,
Marc Hodes,
Domhnaill Hernon,
2009
.
Marc Hodes,
Ross Wilcoxon,
Lisa Steigerwalt Lam,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Kenneth A. Smith,
P. Griffith,
M. Hodes,
2002
.
Georgios Karamanis,
Marc Hodes,
M. Hodes,
2019,
Journal of Electronic Packaging.
M. Hodes,
D. Papageorgiou,
Toby L. Kirk,
2016,
Journal of Fluid Mechanics.
D. Crowdy,
M. Hodes,
Toby L. Kirk,
2018,
Journal of Heat Transfer.
Nagesh R. Basavanhally,
Roland Ryf,
Flavio Pardo,
2009
.
M. Hodes,
D. Papageorgiou,
Georgios Karamanis,
2017
.
Wei Ling,
Salvatore J. Messana,
Paul M. Rominski,
2009,
Bell Labs Technical Journal.