J. Chan

Cost-performance wafer thinning technology

Li Wei Wu, J. Chan, C. S. Hsiao, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Thermal-mechanical simulation of embedded module based on organic substrate

Liqiang Cao, L. Wan, Hongwen He, 2013, 2013 IEEE International Symposium on Advanced Packaging Materials.

Embedded active device packaging technology based on organic substrate

Lixi Wan, Liqiang Cao, J. Chan, 2012, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.

Tool edge honing using shear jamming abrasive media

P. Koshy, J. Chan, 2020 .

Document Similarity Measurement Via Data Compression

Jason Chan, J. Chan, 2006 .