T. Baughn

A new in situ residual stress measurement method for a MEMS thin fixed-fixed beam structure

C. Goldsmith, S. Chen, T. Baughn, 2002 .

High Resolution Characterization of Materials Used in Packages Through Digital Image Correlation

T. Baughn, G. Subbarayan, L. Nguyen, 2005 .

A robust digital image correlation technique for high-resolution characterisation of microelectronic packaging materials

T. Baughn, G. Subbarayan, T. Ratanawilai, 2009 .

Measurement of Temperature-Dependent Young’s Modulus at a Strain Rate for a Molding Compound by Nanoindentation

M. Minary‐Jolandan, T. Baughn, H. Luo, 2017 .

Controlling Adhesion of Orthodontic Adhesives Through Adjustment of the Interphase Mechanical Properties

B. Love, T. Baughn, K. Starling, 1994 .

Measurement of Temperature-Dependent Young’s Modulus at a Strain Rate for a Molding Compound by Nanoindentation

M. Minary‐Jolandan, T. Baughn, Z. Xu, 2016, Experimental mechanics.