R. Emigh

Electrical design for high data rate signals in conventional, BT based PBGA substrates using wire bonded interconnection

R. Emigh, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Miniaturized ultra-wideband band-pass-filter from Silicon Integrated Passive Device technology

Kai Liu, Robert C. Frye, Roger Emigh, 2009, 2009 IEEE MTT-S International Microwave Symposium Digest.

Superplastic properties of an Al2.4Mg1.8Li0.5Sc alloy

R. Emigh, John Morris, E. Bradley, 1991 .

The aluminium-scandium-lithium-magnesium system as a potential source of superplastically formable alloys

R. Emigh, 1990 .

Cryogenic mechanical properties of Al-Cu-Li-Zr alloy 2090

J. Glazer, R. Ritchie, R. Emigh, 1986 .

Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure

Seng Guan Chow, Roger Emigh, Raj Pendse, 2010 .

Fanout flipchip eWLB (embedded Wafer Level Ball Grid Array) technology as 2.5D packaging solutions

Seung Wook Yoon, Patrick Tang, Roger Emigh, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.