M. Miao
发表
Duwei Hu,
M. Miao,
Shenghu Ma,
2012,
2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology.
M. Miao,
Yunbo Shi,
Y. Hao,
2007
.
J. Chen,
Weiqi Wang,
M. Miao,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
S. Bai,
M. Miao,
Yu-feng Jin,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Yufeng Jin,
Zhiyuan Zhu,
Min Miao,
2013,
2013 14th International Conference on Electronic Packaging Technology.
M. Miao,
Wengao Lu,
Yufeng Jin,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
M. Miao,
R. Fang,
Yufeng Jin,
2012,
2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology.
M. Miao,
R. Fang,
Wengao Lu,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
Yufeng Jin,
Min Miao,
Runiu Fang,
2012,
2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS).
Huan Liu,
Yufeng Jin,
Yang Yang,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
M. Miao,
Yufeng Jin,
Huan Liu,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
M. Miao,
Yufeng Jin,
Shengli Ma,
2009,
2009 11th Electronics Packaging Technology Conference.
M. Miao,
Yufeng Jin,
Shengli Ma,
2012,
2012 4th Electronic System-Integration Technology Conference.
M. Miao,
J. Chen,
Yufeng Jin,
2012
.
M. Miao,
Yufeng Jin,
Wenping Kang,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Yufeng Jin,
Min Miao,
Wenping Kang,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
M. Miao,
Yufeng Jin,
Xin Sun,
2008,
2008 9th International Conference on Solid-State and Integrated-Circuit Technology.
M. Miao,
Yufeng Jin,
Wenping Kang,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
M. Miao,
J. Chen,
Yufeng Jin,
2012
.
Yufeng Jin,
Min Miao,
Xin Sun,
2016
.
J. Chen,
M. Miao,
Yufeng Jin,
2014
.
M. Miao,
Bingjie Li,
Zhensong Li,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
M. Miao,
R. Fang,
Yufeng Jin,
2016,
2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP).
Yufeng Jin,
Min Miao,
Xin Sun,
2015,
IEEE Transactions on Electron Devices.
J. Zhang,
S. Bai,
M. Miao,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
M. Miao,
Yufeng Jin,
Liwei Zhao,
2008,
2008 9th International Conference on Solid-State and Integrated-Circuit Technology.
Yufeng Jin,
Min Miao,
Xin Sun,
2014,
2014 15th International Conference on Electronic Packaging Technology.
Jing Chen,
M. Miao,
Yudan Pi,
2018,
International Journal of Heat and Mass Transfer.
Xiaole Cui,
Yufeng Jin,
Min Miao,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Duwei Hu,
M. Miao,
R. Fang,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
M. Miao,
Han Wang,
Na Li,
2019,
Engineering Computations.
M. Miao,
Y. Hao,
Yufeng Jin,
2006,
2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings.
M. Miao,
R. Fang,
Yufeng Jin,
2019,
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI).
H. Gan,
M. Miao,
Yufeng Jin,
2010,
2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology.
Yufeng Jin,
Min Miao,
Xin Sun,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
M. Miao,
R. Fang,
Yufeng Jin,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
M. Miao,
Xiaole Cui,
Zhensong Li,
2017
.
H. Gan,
M. Miao,
Jing Zhang,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Huan Liu,
Yufeng Jin,
Xin Sun,
2016,
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Zhihong Li,
Min Miao,
Yufeng Jin,
2001,
Other Conferences.
Xin Sun,
Yufeng Jin,
Liyuan Wang,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Yufeng Jin,
Huan Liu,
Min Miao,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
M. Miao,
Kunkun Li,
X. Duan,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
Yufeng Jin,
Min Miao,
Xin Sun,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Duwei Hu,
M. Miao,
R. Fang,
2012
.
M. Miao,
Yufeng Jin,
Cao Rui,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Xin Sun,
Yufeng Jin,
Min Miao,
2011,
2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems.
Jing Zhang,
Yufeng Jin,
Min Miao,
2010,
2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems.
M. Miao,
Yufeng Jin,
Shengli Ma,
2022,
Electronics Letters.
Jing Chen,
M. Miao,
Yudan Pi,
2018
.
M. Miao,
Yufeng Jin,
Wenping Kang,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
M. Miao,
J. Chen,
Yufeng Jin,
2012
.
M. Miao,
Yufeng Jin,
Wenping Kang,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Tianfang CHEN,
Min MIAO,
Bo HAN,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Min Miao,
Zhensong Li,
Yuexia Zhang,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
Ying Zhao,
Min Miao,
Yufeng Jin,
2006,
International Commission for Optics.
Xue Chuan Shan,
Ying Zhao,
Min Miao,
2006,
International Commission for Optics.
Wei Wang,
Yufeng Jin,
Wenhua Xu,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).