Shyng-Tsong Chen

Optimization of pitch-split double patterning phoresist for applications at the 16nm node

Brian P. Osborn, S. Holmes, K. Petrillo, 2011, ASMC 2011.

48nm Pitch cu dual-damascene interconnects using self aligned double patterning scheme

J. Kelly, C. Koay, Yunpeng Yin, 2013, 2013 IEEE International Interconnect Technology Conference - IITC.

Integration of Photo-Patternable Low-κ Material into Advanced Cu Back-End-Of-The-Line

Stephan A. Cohen, S. Purushothaman, P. Brock, 2010 .

Electromigration Cu mass flow in Cu interconnections

Robert Rosenberg, Andrew H. Simon, S. T. Chen, 2006 .

The Effect of Material and Process Interactions on BEOL Integration

John C. Arnold, Terry A. Spooner, Satyavolu S. Papa Rao, 2009 .

Magnetic Properties of Graphite Intercalation Compounds.

Shyng-Tsong Chen, 1986 .