M. Mellier

28nm FDSOI technology platform for high-speed low-voltage digital applications

O. Rozeau, D. Noblet, M. Rafik, 2012, 2012 Symposium on VLSI Technology (VLSIT).

Study of resistive random access memory based on TiN/TaOx/TiN integrated into a 65nm advanced complementary metal oxide semiconductor technology

C. Cagli, C. Carabasse, J. Nodin, 2013 .

Kinetic and Diffusional Aspects of the Dissolution of Si in HF Solutions

M. Mellier, J. E. Meerakker, 2001 .

Full Copper Electrochemical Mechanical Planarization (Ecmp) as a Technology Enabler for the 45 and 32nm Nodes

M. C. Luche, M. Rivoire, M. Mellier, 2007, 2007 IEEE International Interconnect Technology Conferencee.

FDSOI bottom MOSFETs stability versus top transistor thermal budget featuring 3D monolithic integration

Maud Vinet, Mikaël Casse, Laurent Brunet, 2014, 2014 44th European Solid State Device Research Conference (ESSDERC).

Continuity and morphology of TaN barriers deposited by Atomic Layer Deposition and comparison with physical vapor deposition

M. Mellier, J. Torres, A. Humbert, 2004 .

14nm FDSOI technology for high speed and energy efficient applications

J. Mazurier, O. Faynot, A. Pofelski, 2014, 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers.

Robust integration of an ULK SiOCH dielectric (k=2.3) for high performance 32nm node BEOL

N. Jourdan, A. Farcy, P. Brun, 2007, 2007 IEEE International Interconnect Technology Conferencee.