Y. Lamy
发表
O. El Bouayadi,
C. Ferrandon,
Laurent Dussopt,
2013,
2013 IEEE International 3D Systems Integration Conference (3DIC).
P. Coudrain,
F. de Crécy,
J. Carpentier,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
F. Fournel,
S. Chéramy,
Y. Lamy,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Y. Lamy,
L. Dussopt,
C. Ferrandon,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
J. Carpentier,
J. Lantéri,
Y. Lamy,
2012,
2012 IEEE/MTT-S International Microwave Symposium Digest.
A. Farcy,
Y. Lamy,
S. Joblot,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
A. Farcy,
Y. Lamy,
S. Joblot,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Y. Lamy,
F. Roozeboom,
D. Gravesteijn,
2010,
IEEE Transactions on Advanced Packaging.
A. Farcy,
J. Carpentier,
Y. Lamy,
2014
.
J. Carpentier,
Y. Lamy,
C. Ferrandon,
2012
.
Y. Lamy,
K. Schoots,
T. Oosterkamp,
2002,
Nature.
P. Perreau,
D. Mariolle,
Y. Lamy,
2020,
2020 IEEE International Ultrasonics Symposium (IUS).
Fred Roozeboom,
Wouter Dekkers,
Eric Cornelis Egbertus Van Grunsven,
2008
.
Pasqualina M. Sarro,
Fred Roozeboom,
Y. Lamy,
2008
.
Yann Lamy,
C. Ferrandon,
H. Sibuet,
2013
.
J. Klootwijk,
Y. Lamy,
W. Besling,
2009
.
Y. Lamy,
R. Salot,
O. Schneegans,
2022,
Advanced Electronic Materials.
Y. Lamy,
B. Viala,
2006,
IEEE transactions on magnetics.
Y. Lamy,
B. Viala,
P. Bayle-Guillemaud,
2009,
0907.2537.
Y. Lamy,
I. Prejbeanu,
B. Viala,
2005,
IEEE Transactions on Magnetics.
Y. Lamy,
B. Viala,
2005
.
Yann Lamy,
Laurent Dussopt,
Cedric Dehos,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Yann Lamy,
Monja Kaiser,
M. Kaiser,
2003
.
Y. Lamy,
S. Franger,
S. Oukassi,
2023,
Small.
Y. Lamy,
S. Poulet,
S. Oukassi,
2022,
ACS Applied Energy Materials.
J. Klootwijk,
R. Wolters,
Y. Lamy,
2008
.
J. Klootwijk,
R. Wolters,
Y. Lamy,
2008
.
Y. Lamy,
E. Tois,
F. Roozeboom,
2010
.
Patrick Leduc,
C. Laviron,
Séverine Cheramy,
2013,
2013 IEEE International 3D Systems Integration Conference (3DIC).