P. Bar

Reliability study for large silicon interposers report on board

P. Coudrain, F. de Crécy, J. Carpentier, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Silicon interposer with integrated antenna array for millimeter-wave short-range communications

J. Carpentier, J. Lantéri, Y. Lamy, 2012, 2012 IEEE/MTT-S International Microwave Symposium Digest.

A Silicon Photonics Technology for 400 Gbit/s Applications

S. Monfray, F. Leverd, N. Vulliet, 2019, 2019 IEEE International Electron Devices Meeting (IEDM).

Copper pillar interconnect capability for mmwave applications in 3D integration technology

Yann Lamy, C. Ferrandon, H. Sibuet, 2013 .

Electrical characterization of millimeter-wave interconnects on low-k and low-loss oxides for advanced 3D silicon interposers

P. Coudrain, J. Carpentier, D. Mercier, 2011, 2011 41st European Microwave Conference.

Thermally stable oscillator at 2.5 GHz using temperature compensated BAW resonator and its integrated temperature sensor

J. Carpentier, D. Barbier, D. Petit, 2008, 2008 IEEE Ultrasonics Symposium.

Strain and tilt mapping in silicon around copper filled TSVs using advanced X-ray nano-diffraction

V. Fiori, A. Farcy, P. Bar, 2015 .

Characterization and modelling of Si-substrate noise induced by RF signal propagating in TSV of 3D-IC stack

R. Anciant, A. Farcy, T. Lacrevaz, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Use of optical metrology techniques for uniformity Control of 3D stacked IC's

P. Bar, D. Le Cunff, M. Tardif, 2014, 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014).