G. Simon
发表
P. Coudrain,
F. de Crécy,
J. Carpentier,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
F. Fournel,
S. Chéramy,
Y. Lamy,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
J. Carpentier,
Y. Lamy,
C. Ferrandon,
2012
.
N. Launay,
G. Pares,
A. Attard,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
R. Anciant,
G. Parès,
A. Attard,
2012
.
S. Moreau,
J. Charbonnier,
R. Hida,
2013,
2013 Eurpoean Microelectronics Packaging Conference (EMPC).
D. Henry,
G. Simon,
É. Duguet,
2020,
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
C. Ferrandon,
F. de Crecy,
S. Moreau,
2013,
2013 Eurpoean Microelectronics Packaging Conference (EMPC).
Yann Lamy,
Laurent Dussopt,
Cedric Dehos,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
S. Moreau,
N. Sillon,
G. Simon,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Myriam Assous,
Kei Murayama,
Mitsuhiro Aizawa,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Stephan Borel,
J. Charbonnier,
J.-C. Souriau,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Maxime Argoud,
Pascal Vivet,
Didier Lattard,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
G. Simon,
Grenoble Alpes,
D. Ratel,
2015
.
Patrick Leduc,
C. Laviron,
Séverine Cheramy,
2013,
2013 IEEE International 3D Systems Integration Conference (3DIC).
Myriam Assous,
Kei Murayama,
Kenichi Mori,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.