T. Lacrevaz
发表
Y. Lamy,
L. Dussopt,
C. Ferrandon,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
A. Farcy,
Y. Lamy,
S. Joblot,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
P. Leduc,
A. Farcy,
T. Lacrevaz,
2009,
2009 IEEE Workshop on Signal Propagation on Interconnects.
A. Farcy,
T. Lacrevaz,
C. Bermond,
2008
.
A. Farcy,
T. Lacrevaz,
C. Bermond,
2005,
IEEE Transactions on Components and Packaging Technologies.
O. Cueto,
M. Gros-Jean,
A. Farcy,
2006,
2006 International Interconnect Technology Conference.
O. Cueto,
M. Gros-Jean,
A. Farcy,
2006
.
P. Coudrain,
J. Carpentier,
D. Mercier,
2011,
2011 41st European Microwave Conference.
V. Laur,
A. Chevalier,
P. Quéffélec,
2014
.
P. Quéffélec,
T. Lacrevaz,
C. Bermond,
2019
.
P. Quéffélec,
T. Lacrevaz,
C. Bermond,
2014
.
A. Farcy,
T. Lacrevaz,
B. Fléchet,
2007,
2007 Asia-Pacific Microwave Conference.
O. Cueto,
A. Farcy,
T. Lacrevaz,
2006
.
M. Gros-Jean,
A. Farcy,
T. Lacrevaz,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
T. Lacrevaz,
C. Bermond,
B. Fléchet,
2021,
Microelectron. J..
B. Ravelo,
T. Lacrevaz,
B. Flechet,
2013,
2013 International Symposium on Electromagnetic Compatibility.
C. Ferrandon,
S. Capraro,
A. Farcy,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
A. Farcy,
T. Lacrevaz,
B. Flechet,
2011,
2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI).
A. Farcy,
T. Lacrevaz,
B. Flechet,
2010,
2010 Asia-Pacific Microwave Conference.
T. Lacrevaz,
C. Bermond,
B. Fléchet,
2011
.
Thierry Lacrevaz,
Bernard Flechet,
Blaise Ravelo,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
B. Ravelo,
T. Lacrevaz,
B. Fléchet,
2019
.
P. Leduc,
A. Farcy,
T. Lacrevaz,
2011
.
R. Anciant,
A. Farcy,
T. Lacrevaz,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
T. Lacrevaz,
T. Vuong,
G. Houzet,
2022,
European Microwave Conference.
Thierry Lacrevaz,
Bernard Flechet,
Blaise Ravelo,
2013,
2013 17th IEEE Workshop on Signal and Power Integrity.
T. Lacrevaz,
T. Vuong,
G. Houzet,
2022,
Microwave and Optical Technology Letters.
A. Farcy,
T. Lacrevaz,
C. Bermond,
2008,
2008 12th IEEE Workshop on Signal Propagation on Interconnects.