C. Bermond

发表

mmW characterization of wafer level passivation for 3D silicon interposer

Y. Lamy, L. Dussopt, C. Ferrandon, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Modeling and Frequency Performance Analysis of Through Silicon Capacitors in Silicon Interposers

A. Farcy, Y. Lamy, S. Joblot, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

High frequency characterization and modeling of high density TSV in 3D integrated circuits

P. Leduc, A. Farcy, T. Lacrevaz, 2009, 2009 IEEE Workshop on Signal Propagation on Interconnects.

Impact of Design on High-Frequency Performance of Advanced MIM Capacitors Using Si $_{3}$ N $_{4}$ Dielectric Layers

A. Farcy, T. Lacrevaz, C. Bermond, 2008 .

Impact of Design on High-Frequency Performance of Advanced MIM Capacitors Using Si $_{3}$N $_{4}$ Dielectric Layers

A. Farcy, T. Lacrevaz, C. Bermond, 2005, IEEE Transactions on Components and Packaging Technologies.

Wide Band Frequency Characterization of High Permittivity Dielectrics (High-K) for RF MIM Capacitors Integrated in BEOL

O. Cueto, M. Gros-Jean, A. Farcy, 2006, 2006 International Interconnect Technology Conference.

Wide band frequency and in situ characterisation of high permittivity insulators (High-K) for H.F. integrated passives

O. Cueto, M. Gros-Jean, A. Farcy, 2006 .

Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs

R. Anciant, N. Sillon, P. Coudrain, 2010, 2010 IEEE International Interconnect Technology Conference.

Intercomparison of Permittivity Measurement Techniques for Ferroelectric Thin Layers

V. Laur, A. Chevalier, P. Quéffélec, 2014 .

Impact of dummies on interconnects network HF propagation performances for the 65nm node

Cedric Bermond, Bernard Flechet, B. Blampey, 2006 .

Impact of dielectrics and metals properties on electrical performances of advanced on-chip interconnects

A. Farcy, C. Bermond, B. Fléchet, 2002, Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).

Effect of water content on microwave dielectric properties of building materials

C. Bermond, P. Artillan, P. Xavier, 2020 .

Characterization and simulation of signal propagation and crosstalk on advanced Cu-SiO/sub 2/ on-chip interconnects for high speed circuits

V. Arnal, Y. Morand, A. Farcy, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Performance Characterization of Advanced Interconnects on High Speed VLSI Circuits

C. Bermond, B. Fléchet, Y. Morand, 2000, 30th European Solid-State Device Research Conference.

O 3 thin film for tunable applications

P. Quéffélec, T. Lacrevaz, C. Bermond, 2019 .

Characterization in a Wide Frequency Range (40 MHz–67 GHz) of a KTa0.65Nb0.35O3 Thin Film for Tunable Applications

P. Quéffélec, T. Lacrevaz, C. Bermond, 2014 .

20 GHz Antenna Radiation Pattern Obtained From Near-Field Mapping With Electrooptic Probe on a Single Plane

L. Duvillaret, C. Bermond, P. Artillan, 2020, IEEE Antennas and Wireless Propagation Letters.

High frequencies characterization of Cu-MIM capacitors in parallel configuration for advanced integrated circuits

O. Cueto, A. Farcy, T. Lacrevaz, 2006 .

Electrical Characterization of Advanced MIM Capacitors With ${\rm ZrO}_{2}$ Insulator for High-Density Packaging and RF Applications

M. Gros-Jean, A. Farcy, T. Lacrevaz, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

In-situ characterization up to 100 GHz of insulators used in new 3D "System in Package on board" (SiPoB) technologies

T. Lacrevaz, C. Bermond, B. Fléchet, 2021, Microelectron. J..

Wide Band Frequency Characterization of Al-Doped and Undoped Rutile TiO2 Thin Films for MIM Capacitors

C. Bermond, P. Gonon, C. Vallée, 2017, IEEE Electron Device Letters.

Electrical characterization and impact on signal integrity of new basic interconnection elements inside 3D integrated circuits

C. Ferrandon, S. Capraro, A. Farcy, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Extraction of equivalent high frequency models for TSV and RDL interconnects embedded in stacks of the 3D integration technology

A. Farcy, T. Lacrevaz, B. Flechet, 2011, 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI).

Wideband frequency and in situ characterization of aluminum nitride (AlN) in a metal/insulator/metal (MIM) configuration

T. Lacrevaz, C. Bermond, B. Fléchet, 2011 .

Ultra wide band frequency characterization of integrated TiTaO-based metal–insulator–metal devices

C. Bermond, B. Fléchet, C. Vallée, 2011 .

Characterization and modeling of RF substrate coupling effects in 3D integrated circuit stacking

P. Leduc, A. Farcy, T. Lacrevaz, 2011 .

Characterization and modelling of Si-substrate noise induced by RF signal propagating in TSV of 3D-IC stack

R. Anciant, A. Farcy, T. Lacrevaz, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Design improvement of RF 3D MIM damascene capacitor

A. Haen, A. Farcy, S. Crémer, 2007, ESSDERC 2007 - 37th European Solid State Device Research Conference.

Impact of ULK restoration techniques on propagation performance for interconnects of the 45 nm technology node and below

A. Farcy, T. Lacrevaz, C. Bermond, 2008, 2008 12th IEEE Workshop on Signal Propagation on Interconnects.

Frequency Effect on Voltage Linearity of $ \hbox{ZrO}_{2}$-Based RF Metal–Insulator–Metal Capacitors

M. Gros-Jean, C. Bermond, B. Fléchet, 2010, IEEE Electron Device Letters.