E. Dede
发表
James T. Allison,
Danny J. Lohan,
E. Dede,
2017
.
Tsuyoshi Nomura,
Ercan M. Dede,
Atsushi Kawamoto,
2019,
Composites Part B: Engineering.
N. Kikuchi,
S. Yamasaki,
T. Matsumori,
2015
.
D. Maksimović,
E. Dede,
R. Erickson,
2019,
2019 20th Workshop on Control and Modeling for Power Electronics (COMPEL).
Xiaoping Qian,
E. Dede,
Xiaoping Qian,
2016
.
A. Yuksel,
E. Dede,
Jaeho Lee,
2021
.
M. Asheghi,
K. Goodson,
E. Dede,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
T. Nomura,
E. Dede,
Jaewook Lee,
2018
.
E. Dede,
Jongwon Shin,
Chi-Ming Wang,
2018,
IEEE Transactions on Power Electronics.
T. Nomura,
Dongjin Kim,
E. Dede,
2020
.
E. Dede,
Joshua L. Gess,
Bharath Ramakrishnan,
2015
.
James T. Allison,
Danny J. Lohan,
Ercan M. Dede,
2016
.
T. Nomura,
E. Dede,
Jaewook Lee,
2014
.
T. Nomura,
E. Dede,
H. Iizuka,
2019,
Physical Review Applied.
E. Dede,
H. Iizuka,
P. Schmalenberg,
2020
.
S. Garimella,
E. Dede,
M. Rau,
2015
.
Tsuyoshi Nomura,
Ercan M. Dede,
Jaewook Lee,
2017
.
T. Nomura,
E. Dede,
Jaewook Lee,
2020,
Journal of Magnetism and Magnetic Materials.
T. Nomura,
G. Yoon,
E. Dede,
2020
.
E. Dede,
Yanghe Liu,
Feng Zhou,
2019,
International Communications in Heat and Mass Transfer.
Ercan M. Dede,
Debasish Banerjee,
Jaewook Lee,
2012
.
T. Nomura,
E. Dede,
Jaewook Lee,
2019,
Composites Part B: Engineering.
E. Dede,
P. Schmalenberg,
Yanghe Liu,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
T. Nomura,
Yuqing Zhou,
E. Dede,
2020,
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
E. Dede,
S. Joshi,
Ziqi Yu,
2020,
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
S. Garimella,
E. Dede,
M. Rau,
2014
.
J. Weibel,
S. Garimella,
E. Dede,
2019,
International Journal of Heat and Mass Transfer.
Danny J. Lohan,
J. Weibel,
E. Dede,
2020,
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Danny J. Lohan,
E. Dede,
S. Joshi,
2020,
Journal of Thermal Science and Engineering Applications.
E. Dede,
S. Joshi,
2017
.
E. Dede,
Feng Zhou,
S. Joshi,
2014,
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
H. Sitaraman,
E. Dede,
S. Narumanchi,
2017
.
M. Asheghi,
K. Goodson,
E. Dede,
2022,
Scientific Reports.
E. Dede,
Feng Zhou,
S. Joshi,
2016
.
E. Dede,
Yanghe Liu,
Feng Zhou,
2019,
Journal of Heat Transfer.
M. Asheghi,
K. Goodson,
E. Dede,
2019
.
T. Nomura,
E. Dede,
Xiaopeng Li,
2022,
Frontiers in Physics.
T. Nomura,
E. Dede,
Jaewook Lee,
2014
.
S. Rodrigues,
E. Dede,
Shoufeng Lan,
2022,
Journal of Nanophotonics.
Danny J. Lohan,
T. Nomura,
Yuqing Zhou,
2022,
Chemical Engineering Journal.
T. Nomura,
E. Dede,
Jaewook Lee,
2022,
Composite Structures.
E. Dede,
2021,
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
T. Nomura,
E. Dede,
S. Min,
2021
.
James T. Allison,
Danny J. Lohan,
Ercan M. Dede,
2020,
Structural and Multidisciplinary Optimization.
James T. Allison,
Danny J. Lohan,
E. Dede,
2019,
Structural and Multidisciplinary Optimization.
Dongjin Kim,
Tsuyoshi Nomura,
Jaewook Lee,
2018,
Composite Structures.
Masanori Ishigaki,
James T. Allison,
Danny J. Lohan,
2016,
DAC 2016.
James T. Allison,
Danny J. Lohan,
E. Dede,
2016,
Structural and Multidisciplinary Optimization.
Xiaoping Qian,
E. Dede,
2016,
Structural and Multidisciplinary Optimization.
Ercan M. Dede,
Shailesh N. Joshi,
E. Dede,
2015
.
Yan Liu,
Jaewook Lee,
Ercan M. Dede,
2012
.
A. Pesaran,
C. Gearhart,
M. Keyser,
2021
.
Chirag R. Kharangate,
M. Asheghi,
K. Goodson,
2019,
International Journal of Heat and Mass Transfer.
Ercan M. Dede,
Hideo Iizuka,
Paul Schmalenberg,
2021,
Nature Photonics.
Jason J. Williams,
N. Chawla,
E. Dede,
2019,
Advanced Engineering Materials.
Tsuyoshi Nomura,
Ercan M. Dede,
Paul Schmalenberg,
2016
.
Tsuyoshi Nomura,
Masanori Ishigaki,
Ercan M. Dede,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Tsuyoshi Nomura,
Ercan M. Dede,
Jaewook Lee,
2014
.
Tsuyoshi Nomura,
Jae Seung Lee,
Ercan M. Dede,
2013
.
Matthew M. Wilkins,
Karin Hinzer,
Masanori Ishigaki,
2019,
IEEE Transactions on Power Electronics.
Danny J. Lohan,
T. Nomura,
Yuqing Zhou,
2022,
Experimental Thermal and Fluid Science.
Ercan M. Dede,
E. Dede,
2012
.
E. Dede,
S. Joshi,
N. Take,
2019,
Advanced Engineering Materials.
Ercan M. Dede,
E. Dede,
2009
.
Gregory M. Hulbert,
Ercan M. Dede,
G. Hulbert,
2009
.
Gregory M. Hulbert,
Ercan M. Dede,
G. Hulbert,
2007
.
Tsuyoshi Nomura,
Ercan M. Dede,
Jaewook Lee,
2012
.
Ercan M. Dede,
E. Dede,
2010
.
Feng Zhou,
Ercan M. Dede,
Raphael Rhote-Vaney,
2017
.
Ercan M. Dede,
E. Dede,
2011
.
Kenneth E. Goodson,
Ercan M. Dede,
Mehdi Asheghi,
2017,
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
E. Dede,
Yanghe Liu,
Feng Zhou,
2016
.
T. Nomura,
E. Dede,
H. Iizuka,
2019
.
M. Asheghi,
K. Goodson,
E. Dede,
2022,
iScience.
T. Nomura,
E. Dede,
H. Iizuka,
2020
.
Tsuyoshi Nomura,
Jaewook Lee,
Ercan M. Dede,
2014
.
J. Weibel,
S. Garimella,
E. Dede,
2020,
International Journal of Heat and Mass Transfer.
Tsuyoshi Nomura,
Ercan M. Dede,
Paul Schmalenberg,
2017
.
Feng Zhou,
Ercan M. Dede,
Shailesh N. Joshi,
2015,
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
Chirag R. Kharangate,
M. Asheghi,
K. Goodson,
2020
.
Ercan M. Dede,
Shailesh N. Joshi,
E. Dede,
2015
.
Yan Liu,
Ercan M. Dede,
E. Dede,
2013
.
T. Nomura,
Yuqing Zhou,
E. Dede,
2022,
Structural and Multidisciplinary Optimization.
Weiqiang Chen,
Ercan M. Dede,
Ali M. Bazzi,
2020,
IEEE Transactions on Power Electronics.
E. Dede,
Yanghe Liu,
S. Joshi,
2020,
Journal of Electronic Packaging.
Mid-frequency response of structures with integral compliant mechanisms: Verification and validation
Gregory M. Hulbert,
Ercan M. Dede,
G. Hulbert,
2008
.
Gregory M. Hulbert,
Ercan M. Dede,
G. Hulbert,
2008
.
T. Nomura,
K. Saitou,
Yuqing Zhou,
2022,
Structural and Multidisciplinary Optimization.
E. Dede,
S. Joshi,
M. Noguchi,
2016,
Electronic Components and Technology Conference.
Ercan M. Dede,
E. Dede,
2014,
2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).
D. Maksimović,
Yuqing Zhou,
E. Dede,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Yuqing Zhou,
E. Dede,
Feng Zhou,
2023,
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
D. Maksimović,
Yuqing Zhou,
E. Dede,
2022,
IEEE transactions on power electronics.
Jae Seung Lee,
E. Dede,
Abhilash Kamineni,
2023,
2023 IEEE Wireless Power Technology Conference and Expo (WPTCE).
E. Dede,
Z. Pantic,
Chungchih Chou,
2021,
IEEE Transactions on Transportation Electrification.
Cost-Efficiency Optimization of Ground Assemblies for Dynamic Wireless Charging of Electric Vehicles
Zeljko Pantic,
Ercan M. Dede,
Reza Tavakoli,
2022,
IEEE Transactions on Transportation Electrification.
Ercan M. Dede,
E. Dede,
2010,
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Feng Zhou,
Ercan M. Dede,
Shailesh N. Joshi,
2017,
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
T. Nomura,
S. Nishiwaki,
E. Dede,
2022,
IEEE Antennas and Wireless Propagation Letters.
E. Dede,
Xinfa Chen,
Yanghe Liu,
2017,
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Tsuyoshi Nomura,
Ercan M. Dede,
Yuqing Zhou,
2020,
Structural and Multidisciplinary Optimization.
E. Dede,
Yanghe Liu,
S. Joshi,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
N. Kikuchi,
G. Hulbert,
Zheng-Dong Ma,
2008
.