M. Hou

Cell rotation using optoelectronic tweezers.

Yuan-Li Liang, Yuan-Peng Huang, Yen-Sheng Lu, 2010, Biomicrofluidics.

A dielectiric liquid-based capcitive tactile sensor for normal and shear force sensing

M. Hou, J. Yeh, K. Liao, 2013, 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).

High-sensitivity dynamical profilometry with a fiber-based composite interferometer.

M. Hou, Chun-Wei Chang, I. Hsu, 2013, Optics letters.

Effect of width on the stress-induced bending of micromachined bilayer cantilevers

M. Hou, Rongshun Chen, M. T. Hou, 2003 .

Nested folded-beam suspensions with low longitudinal stiffness for comb-drive actuators

Chao-Min Chang, Max T. Hou, Ming-Xian Huang, 2014 .

Sacrificial bridges for MEMS fabrication

M. Hou, J. Yeh, Rongshun Chen, 2011 .

On the symmetry of electric fields exerting on interdigitated structures: Qucs equivalent circuit model and experiment

Hiroyuki Fujita, Rongshun Chen, Hiroshi Toshiyoshi, 2011 .

Silicon substrate strength enhancement depending on nanostructure morphology

M. Hou, J. Yeh, Chung-Yao Yang, 2014, The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS).

Nanostructured silicon flapping wing with higher strength and low reflectivity for solar powered MEMS aircraft

M. Hou, J. Yeh, K. Kashyap, 2014, 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS).

Strengthening for sc-Si Solar Cells by Surface Modification With Nanowires

M. Hou, J. Yeh, W. Hsu, 2011, Journal of Microelectromechanical Systems.

Dielectric liquid-based tactile sensing array with tunable sensing range using dielectric force for dynamic tactile sensing

M. Hou, J. Yeh, Amarendra Kumar, 2014, 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

Diagnosis of Esophageal Cancer via Correlation Coefficient of Optical Density

M. Hou, I. Hsu, Shaobin Chen, 2011 .

Backside nanotexturing protected by thin silicon layer for high bending strength ICs

M. Hou, J. Yeh, Chia-Liang Hsu, 2016, 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS).