D. Malta

发表

High density vertical interconnects for 3-D integration of silicon integrated circuits

C. Bower, D. Malta, D. Temple, 2006, 56th Electronic Components and Technology Conference 2006.

Integrated process for defect-free copper plating and chemical-mechanical polishing of through-silicon vias for 3D interconnects

D. Malta, D. Temple, C. Gregory, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs

D. Malta, D. Temple, C. Gregory, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10 µm for infrared focal plane array applications

D. Malta, D. Temple, M. Lueck, 2015 .

High Density 3-D Integration Technology for Massively Parallel Signal Processing in Advanced Infrared Focal Plane Array Sensors

C. Bower, D. Malta, D. Temple, 2006, 2006 International Electron Devices Meeting.

Bonding for 3-D Integration of Heterogeneous Technologies and Materials

D. Malta, D. Temple, M. Skokan, 2008, ECS Transactions.

Characterization and failure analysis of TSV interconnects: From non-destructive defect localization to material analysis with nanometer resolution

F. Altmann, D. Temple, M. Petzold, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Microfabrication of diamond-based slow-wave circuits for mm-wave and THz vacuum electronic sources

D. Malta, M. Lueck, K. Gilchrist, 2011 .

Applying microfabrication to helical vacuum electron devices for THz applications

Carol L. Kory, James A. Dayton, Dean Malta, 2009, 2009 IEEE International Vacuum Electronics Conference.

Fabrication and testing of the 0.650 THz helical BWO

D. Malta, M. Lueck, C. Kory, 2012, IVEC 2012.

95 GHz helical TWT design

D. Malta, M. Lueck, K. Gilchrist, 2009, 2009 IEEE International Vacuum Electronics Conference.

Diamond Field-Effect Transistors

L. S. Plano, D. Malta, B. Stoner, 1994 .

Etch-delineation of defects in diamond by exposure to an oxidizing flame

D. Malta, J. Posthill, R. Markunas, 1993 .

Demonstration of a method to fabricate a large-area diamond single crystal

R. E. Thomas, D. Malta, J. Posthill, 1995 .

Electronic Structure of Polycrystalline PECVD Diamond Surfaces

R. E. Thomas, D. Malta, J. Posthill, 1995 .

Dense Nucleation of Polycrystalline Diamond Films Using CF4-H2 Low Pressure rf Discharges

R. E. Thomas, D. Malta, J. Posthill, 1991 .

Epitaxial nucleation, growth and characterization of highly oriented, (100)-textured diamond films on silicon

D. Malta, R. Glass, B. Stoner, 1994 .

Diamond devices and electrical properties

Dean Malta, L. S. Plano, Michelle L. Hartsell, 1995 .

TSV Formation Overview

Dean Malta, D. Malta, 2014 .

Electrical Properties of Diamond for Device Applications

D. Malta, D. L. Dreifus, G. J. Tessmer, 1995 .

Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications

Chris Gregory, Dorota Temple, John Lannon, 2014, Sensing Technologies + Applications.

Extending acoustic microscopy for comprehensive failure analysis applications

Dorota Temple, Matthias Petzold, Dean Malta, 2011 .

Fabrication of TSV-based silicon interposers

Dorota Temple, Christopher Gregory, Scott H. Goodwin, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

Optimization of chemistry and process parameters for void-free copper electroplating of high aspect ratio through-silicon vias for 3D integration

D. Malta, D. Temple, C. Gregory, 2009, 2009 59th Electronic Components and Technology Conference.

Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization

Dorota Temple, Allan Hilton, John Lannon, 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

TSV-Last Integration to Replace ASIC Wire Bonds in the Assembly of X-Ray Detector Arrays

D. Bordelon, D. Malta, J. Grindlay, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).