K. Sapre

Process Integration Considerations for 300 mm TSV Manufacturing

S. Pamarthy, S. Ramaswami, J. Dukovic, 2009, IEEE Transactions on Device and Materials Reliability.

Robust TSV via-middle and via-reveal process integration accomplished through characterization and management of sources of variation

S. Ramaswami, J. Dukovic, B. Eaton, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Material, Process and Geometry Effects on Through-Silicon Via Reliability and Isolation

Sesh Ramaswami, John O. Dukovic, Aditya P. Karmarkar, 2010 .

Through-silicon-via technology for 3D integration

G. Mori, M. Naik, Z. Cao, 2010, 2010 IEEE International Memory Workshop.