S. Chada

发表

Morphology of surfaces generated by circular wire brushes

R. Stango, R. Fournelle, S. Chada, 1995 .

Lead-free solders: Reliability and other issues a year after the legislation

S. Chada, 2007 .

The qualitative effects of various types of hygiene instrumentation on commercially pure titanium and titanium alloy implant abutments: an in vitro and scanning electron microscope study.

S. Chada, V. Dhuru, G. Ziebert, 1997, The Journal of prosthetic dentistry.

Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure

R. A. Fournelle, D. Shangguan, R. Fournelle, 2000 .

Microstructural Investigation of Sn‐Ag and Sn‐Ag Solder Joints*

R. A. Fournelle, D. Shangguan, R. Fournelle, 1997 .

Journal of Electronic Materials: Foreword

Nikhilesh Chawla, C. Robert Kao, Sung K. Kang, 2006 .

An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates

R. A. Fournelle, D. Shangguan, R. Fournelle, 1999 .

Solidification shrinkage defects in electronic solders

S. Chada, G. Wable, Raymond A. Fournelle, 2005 .