T. Terasaki
发表
J. Nishizawa,
T. Terasaki,
J. Shibata,
1975,
IEEE Transactions on Electron Devices.
H. Tanie,
T. Terasaki,
Nobuhiko Chiwata,
2012
.
M. Nakamura,
T. Terasaki,
T. Kato,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
M. Nakamura,
T. Terasaki,
T. Kato,
2009,
2009 59th Electronic Components and Technology Conference.
J. Nishizawa,
T. Terasaki,
T. Shirasu,
1975
.
J. Nishizawa,
T. Terasaki,
M. Kumagawa,
1968
.
J. Nishizawa,
T. Terasaki,
M. Shimbo,
1974
.
J. Nishizawa,
T. Terasaki,
M. Shimbo,
1972
.
J. Nishizawa,
T. Terasaki,
M. Shimbo,
1972
.
J. Nishizawa,
T. Terasaki,
N. Miyamoto,
1969
.
T. Terasaki,
Takahiko Kato,
H. Akahoshi,
2010,
IEEE Transactions on Electronics Packaging Manufacturing.
H. Tanie,
T. Terasaki,
2005,
2005 International Symposium on Electronics Materials and Packaging.
T. Terasaki,
T. Morita,
Y. Yasuda,
2018,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
K. Serizawa,
H. Shimokawa,
2003
.
T. Terasaki,
2010
.
T. Terasaki,
T. Morita,
Y. Yasuda,
2016,
2016 International Conference on Electronics Packaging (ICEP).
Effect of Manufacturing Process on Micro-Deformation Behavior of Sintered-Silver Die-Attach Material
T. Terasaki,
M. Nishimura,
Tomohisa Suzuki,
2016,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
T. Matsuda,
T. Morita,
2019,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
T. Morita,
Y. Yasuda,
2018,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
1995
.
J. Nishizawa,
T. Terasaki,
N. Miyamoto,
1975
.