K. Bock
发表
H. Gieser,
D. Bonfert,
N. Palavesam,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
K. Bock,
L. Lorenz,
L. Ott,
2020,
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
K. Bock,
M. Albertí,
G. Mohr,
2010
.
L. Overmeyer,
K. Bock,
J. Franke,
2020,
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
Karlheinz Bock,
Klaus-Jurgen Wolter,
Krzysztof Nieweglowski,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
D. Bonfert,
K. Bock,
J. Felba,
2009,
2009 11th Electronics Packaging Technology Conference.
Manufacturing and Reliability Issues of Highly Integrated Packages for Power Electronic Applications
K. Bock,
M. Roellig,
K. Meier,
2019,
2019 42nd International Spring Seminar on Electronics Technology (ISSE).
Ciprian Ionescu,
Karlheinz Bock,
Paul Svasta,
2010,
2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME).
D. Bonfert,
K. Bock,
P. Svasta,
2009,
2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME).
K. Bock,
2005,
Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
K. Bock,
J. Felba,
R. Aschenbrenner,
2003
.
N. Neumann,
D. Plettemeier,
K. Bock,
2020,
Journal of Lightwave Technology.
Karlheinz Bock,
Christof Landesberger,
Sabine Scherbaum,
2011
.
N. Palavesam,
W. Hell,
C. Landesberger,
2020,
Electronics.
C. Landesberger,
K. Bock,
E. Yacoub-George,
2008,
2008 58th Electronic Components and Technology Conference.
Karlheinz Bock,
Krzysztof Nieweglowski,
K. Bock,
2016
.
K. Bock,
L. Lorenz,
K. Nieweglowski,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
F. Ellinger,
K. Nieweglowski,
M. Jazayerifar,
2017,
2017 19th International Conference on Transparent Optical Networks (ICTON).
K. Bock,
Detlef Pabst,
Marcel Stehli,
2018,
WSC 2018.
K. Bock,
H. Malberg,
M. Schubert,
2017,
Materials.
Hagen Malberg,
Sebastian Zaunseder,
Karlheinz Bock,
2017,
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
Karlheinz Bock,
Mike Roellig,
Karsten Meier,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
K. Lang,
K. Bock,
A. Ostmann,
2019,
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
D. Bonfert,
K. Bock,
J. Felba,
2012,
2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO).
C. Landesberger,
K. Bock,
D. Behammer,
2010
.
D. Bonfert,
K. Bock,
I. Bose,
2012,
2012 35th International Spring Seminar on Electronics Technology.
W. Hell,
C. Landesberger,
K. Bock,
2009
.
K. Bock,
W. Duffy,
K. Tetzner,
2013
.
Evaluation of Nanoparticle Inks on Flexible and Stretchable Substrates for Biocompatible Application
K. Bock,
L. Rebohle,
M. Schubert,
2018,
2018 7th Electronic System-Integration Technology Conference (ESTC).
K. Bock,
M. Schubert,
Sabine Friedrich,
2016,
2016 6th Electronic System-Integration Technology Conference (ESTC).
Jörg Franke,
Lihui Wang,
Karlheinz Bock,
2021,
CIRP Annals.
D. Bonfert,
K. Bock,
G. Klink,
2012,
2012 4th Electronic System-Integration Technology Conference.
D. Bonfert,
K. Bock,
P. Svasta,
2013,
Proceedings of the 36th International Spring Seminar on Electronics Technology.
S. Kaierle,
L. Overmeyer,
K. Bock,
2021,
2021 14th International Congress Molded Interconnect Devices (MID).
Karlheinz Bock,
Indranil Bose,
Kornelius Tetzner,
2014,
Microelectron. Reliab..
Karlheinz Bock,
Karsten M. Decker,
K. M. Decker,
2017,
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Karlheinz Bock,
Tobias Tiedje,
Karsten Meier,
2016,
2016 39th International Spring Seminar on Electronics Technology (ISSE).
Karlheinz Bock,
Christof Landesberger,
Christoph Kutter,
2015,
2015 11th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME).
N Palavesam,
E Yacoub-George,
W Hell,
2018,
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
K. Bock,
K. Schroder,
K. Tetzner,
2014
.
D. Bonfert,
K. Bock,
P. Svasta,
2013,
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME).
K. Bock,
K. Meier,
M. Luniak,
2020,
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
K. Bock,
K. Meier,
M. Luniak,
2020,
2020 43rd International Spring Seminar on Electronics Technology (ISSE).
K. Bock,
M. Mäntysalo,
T. Vuorinen,
2019,
Materials.
C. Landesberger,
K. Bock,
H. Spöhrle,
2014
.
D. Bonfert,
K. Bock,
G. Klink,
2010,
33rd International Spring Seminar on Electronics Technology, ISSE 2010.
K. Bock,
E. Hammerl,
K. Bock,
2005,
Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
Karlheinz Bock,
Aman Russom,
Marcella Chiari,
2013,
Lab on a chip.
Karlheinz Bock,
Sonia Marin,
Christof Landesberger,
2018
.
Karlheinz Bock,
K. Bock,
2005,
Proceedings of the IEEE.
Karlheinz Bock,
Tetiana Voitsekhivska,
Sabine Kirsten,
2015,
2015 38th International Spring Seminar on Electronics Technology (ISSE).
K. Bock,
Christian Götze,
K. Meier,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
K. Bock,
K. Meier,
Thomas Ackstaller,
2020,
Information Security Solutions Europe.
Christel Baier,
Frank Ellinger,
Wolfgang Lehner,
2019,
Proceedings of the IEEE.
C. Mayr,
K. Bock,
F. Ellinger,
2020,
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
D. Plettemeier,
K. Bock,
F. Ellinger,
2021,
Tactile Internet.
K. Bock,
I. Bose,
K. Tetzner,
2014,
Materials.
Karlheinz Bock,
Christof Landesberger,
Herbert Schuck,
2010,
2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP).
Karlheinz Bock,
Christof Landesberger,
Matthias Ebert,
2007,
Microelectron. Reliab..
K. Bock,
K. Bock,
A. Drost,
2005,
Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..
H. Gieser,
W. Hell,
C. Landesberger,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
K. Bock,
David Weyers,
Krszystof Nieweglowski,
2022,
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
K. Bock,
K. Nieweglowski,
David Weyers,
2022,
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
K. Bock,
David Weyers,
Akash Mistry,
2022,
Electronic Components and Technology Conference.
K. Bock,
L. Lorenz,
K. Nieweglowski,
2021,
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Jörg Franke,
Stefan Kaierle,
Ludger Overmeyer,
2021,
OPTO.
C. Landesberger,
K. Bock,
S. Scherbaum,
2007
.
Karlheinz Bock,
Hans Wolf,
Waltraud Hell,
2007,
Biosensors & bioelectronics.
K. Bock,
K. Bock,
M. Feil,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
Karlheinz Bock,
Lukas Lorenz,
Thomas Ackstaller,
2020,
Photonics Europe.
Karlheinz Bock,
Metin Koyuncu,
Enno Lorenz,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).