G. May
发表
Muhannad S. Bakir,
Gary S. May,
Hanju Oh,
2015,
2015 International 3D Systems Integration Conference (3DIC).
M. Bakir,
Hanju Oh,
G. May,
2015
.
M. Bakir,
Li Zheng,
Hanju Oh,
2016,
IEEE Transactions on Electron Devices.
M. Swaminathan,
M. Bakir,
Hanju Oh,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Paul K. Jo,
M. Bakir,
G. May,
2017,
IEEE Electron Device Letters.
M. Bakir,
Hanju Oh,
G. May,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
G. Ponchak,
J. Papapolymerou,
G. May,
2012,
IEEE Transactions on Microwave Theory and Techniques.
M. Bakir,
Hanju Oh,
G. May,
2015
.
Thomas E. Sarvey,
M. Bakir,
Hanju Oh,
2016,
2016 IEEE 20th Workshop on Signal and Power Integrity (SPI).
M. Bakir,
Hanju Oh,
G. May,
2016,
IEEE Transactions on Electron Devices.
D. Staiculescu,
J. Laskar,
G.S. May,
2005,
IEEE Transactions on Advanced Packaging.
Gary S. May,
J. Chung,
Ping Keung Ko,
1989
.
Paragkumar Thadesar,
M. Bakir,
G. May,
2013,
2013 IEEE International Interconnect Technology Conference - IITC.
Paragkumar Thadesar,
M. Bakir,
G. May,
2013,
ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference.
G. May,
D. Baker,
C. Himmel,
1994,
Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium.
G. May,
W. Hunt,
J. Kenney,
1993,
Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium.
Ilgu Yun,
Gary S. May,
G. May,
1999,
ICMTS 1999.
Gary S. May,
C. D. Himmel,
G. May,
1992,
[1992 Proceedings] IEEE/SEMI International Semiconductor Manufacturing Science Symposium.
Sreejith Kochupurackal Rajan,
M. Bakir,
G. May,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
J. Laskar,
J.H. Lee,
G.S. May,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
G. May,
G. May,
T. Thongvigitmanee,
2000,
Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).
Muhannad S. Bakir,
Gary S. May,
Sang Jeen Hong,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
M. Allen,
M. Bakir,
Hanju Oh,
2018,
ACS applied materials & interfaces.
Muhannad S. Bakir,
Sreejith Kochupurackal Rajan,
Ming Jui Li,
2019,
2019 International 3D Systems Integration Conference (3DIC).
Monolithic Microfluidic Cooling of a Heterogeneous 2.5-D FPGA With Low-Profile 3-D Printed Manifolds
Thomas E. Sarvey,
Sreejith Kochupurackal Rajan,
M. Bakir,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Thomas E. Sarvey,
Sreejith Kochupurackal Rajan,
M. Bakir,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Muhannad S. Bakir,
Gary S. May,
Xuchen Zhang,
2018,
IEEE Transactions on Electron Devices.
Sreejith Kochupurackal Rajan,
Joe L. Gonzalez,
R. Bellamkonda,
2021,
IEEE Sensors Journal.
Maysam Ghovanloo,
Muneeb Zia,
Muhannad S. Bakir,
2017,
2017 IEEE Biomedical Circuits and Systems Conference (BioCAS).
Muhannad S. Bakir,
Gary S. May,
Hanju Oh,
2016
.
Paragkumar Thadesar,
M. Bakir,
Hanju Oh,
2016,
IEEE Microwave and Wireless Components Letters.
Ilgu Yun,
Gary S. May,
G. May,
1997,
Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium.