Lei Nie
发表
M. Pecht,
M. Azarian,
Lei Nie,
2007
.
Lei Nie,
Chongliang Zhong,
Z. Qiao,
2021
.
Tielin Shi,
Zirong Tang,
Lei Nie,
2010
.
T. Shi,
Lei Nie,
Zirong Tang,
2007,
2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems.
M. Osterman,
M. Pecht,
Fubin Song,
2009,
IEEE Transactions on Components and Packaging Technologies.
M. Pecht,
M. Osterman,
Lei Nie,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Lei Nie,
P. Zou,
Shuibin Feng,
2015,
Journal of microencapsulation.
Lei Nie,
P. Zou,
Shuibin Feng,
2015
.
T. Shi,
G. Liao,
Lei Nie,
2016,
Wuhan University Journal of Natural Sciences.
T. Shi,
G. Liao,
Shiyuan Liu,
2009
.
Lei Nie,
W. Xiang,
Hua Jing Li,
2014
.
T. Shi,
G. Liao,
Lei Nie,
2010
.
T. Shi,
G. Liao,
Lei Nie,
2006,
2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems.
C. Chen,
T. Shi,
G. Liao,
2022,
Nanotechnology.
Lei Nie,
P. Zou,
Shuibin Feng,
2015,
Chinese Journal of Polymer Science.
Hao Jiang,
Xiuguo Chen,
Shiyuan Liu,
2020,
Optics letters.
Lei Nie,
P. Zou,
Shuibin Feng,
2013
.
B. Yin,
Z. Wang,
Lei Nie,
2019,
SN Applied Sciences.
Lei Nie,
P. Zou,
Shuibin Feng,
2013,
Journal of Materials Science: Materials in Medicine.
Lei Nie,
P. Zou,
Shuhua Yang,
2012,
Colloids and surfaces. B, Biointerfaces.
Lei Nie,
Yang Peng,
Mingxiang Chen,
2017,
IEEE Transactions on Electron Devices.
Lei Nie,
P. Zou,
Shuibin Feng,
2012
.
Lei Nie,
Dongming Qi,
Jiawei Li,
2021,
Journal of Polymer Engineering.
Lei Nie,
Songliang Jia,
Shuidi Wang,
2005,
2005 6th International Conference on Electronic Packaging Technology.
Lei Nie,
P. Zou,
Shuibin Feng,
2012
.
H. Hu,
Lei Nie,
Shuibin Feng,
2013,
Pharmazie.
T. Shi,
G. Liao,
Lei Nie,
2011,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Lei Nie,
Qiuju Zhou,
Pengbo Chang,
2018,
Applied Sciences.
H. Hu,
Lei Nie,
P. Zou,
2013
.
Tielin Shi,
Lei Nie,
Zirong Tang,
2009,
2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems.
Lei Nie,
Qi Yang,
Jinping Suo,
2013
.
Process, reliability test, and interfacial characterization for low temperature wafer direct bonding
Tielin Shi,
Zirong Tang,
Xiaohui Lin,
2007,
International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT).
Li Wei,
Wei Wei,
Lei Su,
2015
.
Lei Nie,
P. Zou,
Shuibin Feng,
2015,
Journal of microencapsulation.
T. Shi,
G. Liao,
Lei Nie,
2010,
IEEE Transactions on Advanced Packaging.