Asit Kumar Gain

发表

Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages

Y. C. Chan, Asit Kumar Gain, Ahmed Sharif, 2009, Microelectron. Reliab..

Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates

Y. C. Chan, Asit Kumar Gain, Winco K. C. Yung, 2011, Microelectron. Reliab..

High-temperature and humidity change the microstructure and degrade the material properties of tin‑silver interconnect material

Asit Kumar Gain, Liangchi Zhang, Liangchi Zhang, 2018, Microelectron. Reliab..

Growth nature of in-situ Cu6Sn5-phase and their influence on creep and damping characteristics of Sn-Cu material under high-temperature and humidity

Asit Kumar Gain, Liangchi Zhang, Liangchi Zhang, 2018, Microelectron. Reliab..

Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solders

Y. C. Chan, Asit Kumar Gain, 2014, Microelectron. Reliab..

Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy

Y. C. Chan, Asit Kumar Gain, Ahmed Sharif, 2010, Microelectron. Reliab..

Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads

Y. C. Chan, Asit Kumar Gain, Winco K. C. Yung, 2011, Microelectron. Reliab..

Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads

Y. C. Chan, Asit Kumar Gain, Ahmed Sharif, 2010, Microelectronics Reliability.

Effect of small Sn-3.5Ag-0.5Cu additions on the structure and properties of Sn-9Zn solder in ball grid array packages

Y. C. Chan, Winco K.C. Yung, Asit Kumar Gain, 2009 .

Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates

Y. C. Chan, Asit Kumar Gain, Y. Chan, 2015, Journal of Materials Science: Materials in Electronics.

Microstructure, thermal analysis and damping properties of Ag and Ni nano-particles doped Sn–8Zn–3Bi solder on OSP–Cu substrate

Asit Kumar Gain, Liangchi Zhang, A. K. Gain, 2014 .

Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads

Y. C. Chan, Winco K.C. Yung, Asit Kumar Gain, 2010 .

The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads

Y. C. Chan, Winco K.C. Yung, Asit Kumar Gain, 2010 .

The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn–Ag–Cu solder on OSP-Cu pads

Y. C. Chan, Asit Kumar Gain, 2012 .

Harsh service environment effects on the microstructure and mechanical properties of Sn–Ag–Cu-1 wt% nano-Al solder alloy

Asit Kumar Gain, Liangchi Zhang, A. K. Gain, 2016, Journal of Materials Science: Materials in Electronics.

Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin–bismuth–silver (Sn–Bi–Ag) solder on copper (Cu) substrate

Asit Kumar Gain, Liangchi Zhang, A. K. Gain, 2016, Journal of Materials Science: Materials in Electronics.

Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy

Asit Kumar Gain, Liangchi Zhang, A. K. Gain, 2016 .

Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1 wt% nano-ZrO2 composite solder on OSP-Cu pads

Y. C. Chan, Winco K.C. Yung, Asit Kumar Gain, 2011 .

Microstructure, mechanical and electrical performances of zirconia nanoparticles-doped tin-silver-copper solder alloys

Asit Kumar Gain, Liangchi Zhang, A. K. Gain, 2016, Journal of Materials Science: Materials in Electronics.

Effect of thin gold/nickel coating on the microstructure, wettability and hardness of lead-free tin–bismuth–silver solder

Asit Kumar Gain, Liangchi Zhang, A. K. Gain, 2017, Journal of Materials Science: Materials in Electronics.