P. Gunupudi

Analysis of transmission line circuits using multi-dimensional model reduction techniques

M. Nakhla, P. Gunupudi, R. Khazaka, 2001, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).

Passive interconnect reduction algorithm for distributed/measured networks

Michel Nakhla, P. Gunupudi, Eli Chiprout, 2000 .

Nonlinear Electronic/Photonic Component Modeling Using Adjoint State-Space Dynamic Neural Network Technique

Qi-Jun Zhang, Sayed Alireza Sadrossadat, Pavan Gunupudi, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Self-Consistent Simulation of Opto-Electronic Circuits Using a Modified Nodal Analysis Formulation

P Gunupudi, T Smy, J Klein, 2010, IEEE Transactions on Advanced Packaging.

Nonlinear circuit-reduction of high-speed interconnect networks using congruent transformation techniques

Michel Nakhla, P. Gunupudi, M. Nakhla, 2001 .

Fast Simulation of steady-state temperature distributions in electronic components using multidimensional model reduction

R. Khazaka, D. Celo, D. Celo, 2005, IEEE Transactions on Components and Packaging Technologies.

Passive parameterized time-domain macromodels for high-speed transmission-line networks

Michel Nakhla, P. Gunupudi, Tom J. Smy, 2003 .

Hierarchical thermal analysis of large IC modules

M.S. Nakhla, R. Khazaka, D. Celo, 2005, IEEE Transactions on Components and Packaging Technologies.

The creation of compact thermal models of electronic components using model reduction

M.S. Nakhla, R. Khazaka, D. Celo, 2005, IEEE Transactions on Advanced Packaging.

The creation of compact thermal models of electronic components using model reduction

M. Nakhla, T. Smy, P. Gunupudi, 2004, Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545).