Jong-Min Paik

Linewidth dependence of grain structure and stress in damascene Cu lines

Young‐Chang Joo, Jong-Min Paik, Il-Mok Park, 2006 .

Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low-k interconnects for ULSI

Young‐Chang Joo, Jong-Min Paik, Il-Mok Park, 2006 .

The dielectric material dependence of stress and stress relaxation on the mechanism of stress-voiding of Cu interconnects

Young‐Chang Joo, Jong-Min Paik, Jung-Kyu Jung, 2005, 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual..

Anisotropy of grain boundary energies as cause of abnormal grain growth in electroplated copper films

Young‐Chang Joo, Jong-Min Paik, Je‐hun Lee, 2003 .

Effect of dielectric materials on stress-induced damage modes in damascene Cu lines

Young-Chang Joo, Jong-Min Paik, Young‐Chang Joo, 2005 .

Effect of low- k dielectric on stress and stress-induced damage in Cu interconnects

Young-Chang Joo, Jong-Min Paik, Young‐Chang Joo, 2004 .

Relationship between grain structures and texture of damascene Cu lines

Young‐Chang Joo, Jong-Min Paik, Ki-Chul Park, 2004 .