O. Luehn

发表

Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV

B. Verlinden, R. Labie, B. Vandevelde, 2010 .

Adhesive One Step Ni/Ag and Ni/Cu/Ag Inline Direct Plating on Laser Processed Selective Emitter Structures

O. Luehn, H. Nussbaumer, D. Kray, 2010 .

Copper Plating for 3D Interconnects

Hugo Bender, Wouter Ruythooren, Harold Philipsen, 2010, ECS Transactions.

High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

G. Dilliway, Alex Radisic, G. Druais, 2008 .

Barrier and seed layer coverage in 3D structures with different aspect ratios using sputtering and ALD processes

C. Hoof, J. Celis, O. Luehn, 2008 .

Filling of microvia with an aspect ratio of 5 by copper electrodeposition

C. Hoof, J. Celis, O. Luehn, 2009 .

Changing Superfilling Mode for Copper Electrodeposition in Blind Holes from Differential Inhibition to Differential Acceleration

Jean-Pierre Celis, Philippe M. Vereecken, Wouter Ruythooren, 2009 .

Monitoring the Superfilling of Blind Holes with Electrodeposited Copper

A. Radisic, C. Hoof, J. Celis, 2010 .

Characterization and module integration of full electroplated contacts on silicon solar cells

O. Luehn, H. Nussbaumer, D. Kray, 2011 .