K. Anzai

Reply to Comments on "Dose Perturbation by Wafer Charging During Ion Implantation"

T. Ohmi, Yoshiyuki Sato, K. Anzai, 1992 .

Thick Film and Direct Bond Copper Forming Technologies for Aluminum Nitride Substrate

K. Anzai, K. Shinozaki, N. Iwase, 1985 .

Thermal shock resistance of silicon nitride

K. Anzai, H. Hashimoto, 1977 .

A Silicon Oxide Antireflective Layer For Optical Lithography Using Electron Cyclotron Resonance Plasma Deposition

K. Anzai, Mikiho Kiuchi, Y. Mimura, 1996 .